ClassID:

211343

H01L2224/83495 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a gas not provided for in groups  -