211349 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Soldering or alloying involving forming a eutectic alloy at the bonding interface
Bonding Structure
#2LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
#3DISPLAY PANEL
#4LIQUID METAL THERMAL INTERFACE
#5Solid metal foam thermal interface material
#6Light emitting diode display with redundancy scheme
#7Heterogeneous Chip Integration of III-Nitride-based Materials for Optoelectronic Device Arrays in the Visible and Ultraviolet
#8Method for wafer bonding and compound semiconductor wafer
#9Light emitting diode display with redundancy scheme
#10Electronic device
#11Light emitting device and fluidic manufacture thereof
#12METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#13Low drain-source on resistance semiconductor component and method of fabrication
#14Method for forming semiconductor structure
#15Multi-junction LED with eutectic bonding and method of manufacturing the same
#16Multilayered transient liquid phase bonding
#17Light emitting diode display with redundancy scheme
#18Semiconductor structure and method for forming the same
#19Device and method for producing a device
#20Wafer level flat no-lead semiconductor packages and methods of manufacture
#21Wafer level flat no-lead semiconductor packages and methods of manufacture
#22Wafer level flat no-lead semiconductor packages and methods of manufacture
#23Light emitting device and fluidic manufacture thereof
#24Systems and methods for semi-flexible eutectic bonder piece arranegments
#25Low-temperature bonding with spaced nanorods and eutectic alloys
#26Wafer level flat no-lead semiconductor packages and methods of manufacture
#27Light emitting diode display with redundancy scheme
#28Method and device for vacuum reacting force soldering
#29Surface mount package and manufacturing method thereof
#30Semiconductor device fabricated by flux-free soldering
#31Ring-frame power package
#32Semiconductor structure and method of manufacturing the same
#33Light emitting device and fluidic manufacture thereof
#34Semiconductor structure and method of manufacturing the same
#35Power semiconductor device with small contact footprint and the preparation method
#36Broadband radio frequency power amplifiers, and methods of manufacture thereof
#37PROCESS OF FORMING SEMICONDUCTOR DEVICE
#38Heatsink very-thin quad flat no-leads (HVQFN) package
#39Power semiconductor package device having locking mechanism, and preparation method thereof
#40Wafer stack protection seal
#41Manufacturing method of forming a semiconductor wafer structure
#42Semiconductor package structure and method for manufacturing the same
#43Leadless chip carrier having improved mountability
#44Method and apparatus for a seal ring structure
#45Laser assisted transfer welding process
#46Wafer to wafer bonding process and structures
#47Semiconductor bonding structure and process
#48MEMS integrated pressure sensor devices having isotropic cavitites and methods of forming same
#49Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof
#50Method of making a semiconductor device having a functional capping
#51Method for MEMS structure with dual-level structural layer and acoustic port
#52Wafer level flat no-lead semiconductor packages and methods of manufacture
#53Semiconductor laser structure
#54Methods of fabricating micro electro mechanical system structures
#55Micromechanical sensor device
#56LED light-emitting device
#57Power semiconductor device with small contact footprint and the preparation method
#58Package systems
#59Light emitting diode display with redundancy scheme
#60Stacked semiconductor device and method of forming the same related cases
#61CMOS-MEMS integration by sequential bonding method
#62Mounting method
#63Hermetically sealed wafer packages
#64Apparatus for eutectic bonding
#65Sealing structure for a bonded wafer and method of forming the sealing structure
#66Laser de-bond carrier wafer from device wafer
#67Bonded processed semiconductor structures and carriers
#68Die substrate assembly and method
#69Optical coupling module
#70Semiconductor bonding structure and process
#71Semiconductor package having a baseplate with a die attach region and a peripheral region
#72Method and system for co-packaging vertical gallium nitride power devices
#73Method for bonding wafers and structure of bonding part
#74Stackable package by using internal stacking modules
#75MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same
#76Method of fabricating a light emitting diode display with integrated defect detection test
#77Wafer stack protection seal
#78Stacked semiconductor device and method of forming the same related cases
#79Methods for bonding a die and a substrate
#80Semiconductor devices that include a die bonded to a substrate with a gold interface layer
#81Light emitting device
#82Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#83Method for forming a thin semiconductor device
#84Method and apparatus for a seal ring structure
#85Package systems and manufacturing methods thereof
#86Semiconductor bonding structure and process
#87Method of and device for manufacturing LED assembly using liquid molding technologies
#88Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
#89Integrated circuit, a chip package and a method for manufacturing an integrated circuit
#90Bonding layer structure and method for wafer to wafer bonding
#91Method for manufacturing a component having an electrical through-connection
#92Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#93Semiconductor component support and semiconductor device
#94METHOD AND APPARATUS FOR PROVIDING IMPROVED BACKSIDE METAL CONTACTS TO SILICON CARBIDE
#95Electric device package and method of making an electric device package
#96Package structure and substrate bonding method
#97Chip package and method for assembling chip package
#98Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
#99Chip package and method of forming the same
#100Bonded processed semiconductor structures and carriers
#101PCB based RF-power package window frame
#102Clip frame semiconductor packages and methods of formation thereof
#103Manufacturing method of semiconductor device
#104Method of manufacturing semiconductor element
#105Semiconductor element and method of manufacturing same
#106Method of transferring and bonding an array of micro devices
#107Micro electro mechanical system structures
#108Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates
#109Electrically bonded arrays of transfer printed active components
#110Resin paste composition
#111Multi-die semiconductor package
#112Method of fabricating a semiconductor device having recessed bonding site
#113Laminate electronic device
#114Hermetically sealed wafer packages
#115Electronic component module
#116Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
#117METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
#118Method of making a semiconductor device having a functional capping
#119Method for processing a semiconductor wafer or die, and particle deposition device
#120Semiconductor package with embedded die and manufacturing methods thereof
#121POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE
#122Light emitting die (LED) packages and related methods
#123Method for bonding of chips on wafers
#124Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices
#125LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
#126Chip scale surface mounted semiconductor device package and process of manufacture
#127Force sensor
#128Laser assisted transfer welding process
#129Bonding process and bonded structures
#130HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS
#131Bonding process and bonded structures
#132Package systems having a eutectic bonding material and manufacturing methods thereof
#133Package systems having an opening in a substrate thereof and manufacturing methods thereof
#134Bonding process and bonded structures
#135Multi-chip semiconductor packages and assembly thereof
#136Method for mounting luminescent device
#137LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
#138Semiconductor device and method of forming composite bump-on-lead interconnection
#139Substrate bonding with metal germanium silicon material
#140Semiconductor module and method for production thereof
#141Composite wafer semiconductor
#142Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
#143Chip package and fabricating method thereof
#144Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region
#145Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
#146Method for manufacturing a semiconductor device using an Al-Zn connecting material
#147Electronic package with stacked semiconductor chips
#148LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING
#149Junction body, semiconductor module, and manufacturing method for junction body
#150Method and system for forming a thin semiconductor device
#151Method for forming a transducer
#152Semiconductor device and manufacturing method of the same
#153Light emitting device and light unit having improved electrode and chip structures with concave/convex shapes
#154Method of making a mounted gallium nitride device
#155Die bonding a semiconductor device
#156Semiconductor package and method of manufacturing the same
#157Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
#158Joint structure, joining material, and method for producing joining material containing bismuth
#159Laminate electronic device
#160SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR
#161Semiconductor device including first and second carriers
#162Stackable Package By Using Internal Stacking Modules
#163Chip scale surface mounted semiconductor device package and process of manufacture
#164Packaged semiconductor chips
#165COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD
#166Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support
#167Substrate bonding with metal germanium silicon material
#168Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste
#169High temperature resistant solid state pressure sensor
#170Thermally enhanced electronic package
#171Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#172Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices
#173Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief
#174Semiconductor device
#175POWER SEMICONDUCTOR MODULE
#176Semiconductor Chip Package System Vertical Interconnect
#177Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#178Transducer with fluidly isolated connection
#179TRANSIENT LIQUID PHASE EUTECTIC BONDING
#180Semiconductor device and method of forming composite bump-on-lead interconnection
#181Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
#182Method of making semiconductor devices employing first and second carriers
#183Method for making a transducer
#184Semiconductor device and manufacturing method of the same
#185Semiconductor device and method of manufacturing the same
#186Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer
#187Transducer for use in harsh environments
#188LIGHT EMITTING DIODE PACKAGE
#189SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
#190Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate
#191Electronic component module
#192Semiconductor device and process for fabrication thereof
#193LOW-STRESS HERMETIC DIE ATTACH
#194CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE
#195Microcircuit package having ductile layer
#196Semiconductor Device And Production Method For Semiconductor Device
#197Flip-chip packaging structure for light emitting diode and method thereof
#198Packaged semiconductor chips
#199Light emitting diode package
#200Electronic module with switching functions and method for producing the same
#201Resin Paste For Die Bonding And Its Use
#202Method for producing a chip-substrate connection
#203Semiconductor device and method for producing the same
#204Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
#205Schottky Diode Device with Aluminum Pickup of Backside Cathode
#206Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
#207Double-sided package for power module
#208Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector
#209Semiconductor device
#210Large die package and method for the fabrication thereof
#211Schottky diode device with aluminum pickup of backside cathode
#212Semiconductor chip and method manufacturing the same
#213Semiconductor device and process for fabrication thereof
#214Thin-film semiconductor component and production method for said component
#215Chip on board leadframe for semiconductor components having area array
#216Die paddle clamping method for wire bond enhancement
#217Circuit device and portable device with symmetrical arrangement
#218Semiconductor device and manufacturing method of the same
#219Die bonded device and method for transistor packages
#220Apparatus for singulating and bonding semiconductor chips, and method for the same
#221Systems and methods for wafer bonding by localized induction heating
#222Package and method for packaging an integrated circuit die
#223System and method for forming one or more integrated circuit packages using a flexible leadframe structure
#224Semiconductor chip arrangement and method
#225Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#226Semiconductor device assembly process
#227Method for fabricating semiconductor component with chip on board leadframe
#228Semiconductor component having chip on board leadframe
#229Semiconductor device including a potential drawing portion formed at a corner
#230Semiconductor package production method and semiconductor package