211353 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Soldering or alloying; Diffusion bonding Solid-liquid interdiffusion
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#2SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#3Advanced Device Assembly Structures And Methods
#4Bonding Structure
#5LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
#6INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
#7DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
#8Light emitting diode display with redundancy scheme
#9Advanced device assembly structures and methods
#10Semiconductor structure having silver-indium transient liquid phase bonding joint
#11Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding joint
#12Transient liquid phase bonding compositions and power electronics assemblies incorporating the same
#13Semiconductor packages with an intermetallic layer
#14Light emitting diode display with redundancy scheme
#15Soldering a conductor to an aluminum layer
#16Method of liquid assisted bonding
#17Chip assembly
#18Multilayered transient liquid phase bonding
#19Electronic devices formed in a cavity between substrates
#20Light emitting diode display with redundancy scheme
#21Method of forming a leadless stack comprising multiple components
#22Electronic component structures with reduced microphonic noise
#23Semiconductor device having an antenna arranged over an active main surface of a semiconductor die
#24Method of manufacturing a package having a power semiconductor chip
#25Semiconductor device with high quality and reliability wiring connection, and method for manufacturing the same
#26DIE BONDING TO A BOARD
#27Sintering pastes with high metal loading for semiconductor die attach applications
#28Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#29Device and method for producing a device
#30Bonded structure and method of manufacturing the same
#31Leadless multi-layered ceramic capacitor stack
#32Electronic devices formed in a cavity between substrates and including a via
#33Methods of manufacturing electronic devices formed in a cavity
#34Methods of manufacturing electronic devices formed in a cavity and including a via
#35Hermetically sealed MEMS device and its fabrication
#36Light emitting diode display with redundancy scheme
#37Chip assembly
#38Leadless stack comprising multiple components
#39Package with vertical interconnect between carrier and clip
#40Non-eutectic bonding
#41APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL PARTS
#42Semiconductor packages with an intermetallic layer
#43Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom
#44Electronic component structures with reduced microphonic noise
#45Die bonding to a board
#46Alternative compositions for high temperature soldering applications
#47Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#48Integrated packaging of multiple double sided cooling planar bond power modules
#49Device comprising a connecting component and method for producing a connecting component
#50Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
#51Method for the diffusion soldering of an electronic component to a substrate
#52Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#53Method for bonding with a silver paste
#54Method of bonding with silver paste
#55Method of forming a chip assembly with a die attach liquid
#56Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
#57Leadless multi-layered ceramic capacitor stacks
#58Semiconductor device and method of manufacturing the same
#59Process for connecting joining parts
#60Light emitting diode display with redundancy scheme
#61Semiconductor device
#62Mounting method
#63Hermetically sealed wafer packages
#64Semiconductor modules with semiconductor dies bonded to a metal foil
#65Semiconductor device having multiple contact clips
#66Semiconductor device and method for manufacturing a semiconductor device
#67Semiconductor device and method for manufacturing the same
#68Connection arrangement of an electric and/or electronic component
#69Semiconductor device
#70Method of fabricating a light emitting diode display with integrated defect detection test
#71Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds
#72Active matrix emissive micro LED display
#73Advanced device assembly structures and methods
#74Semiconductor device
#75Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
#76Semiconductor packaging containing sintering die-attach material
#77Strong, heat stable junction
#78Submicron connection layer and method for using the same to connect wafers
#79Leadless multi-layered ceramic capacitor stacks
#80Method for manufacturing a chip package
#81METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND BONDING STRUCTURE
#82Package structure and substrate bonding method
#83Semiconductor device including a polymer disposed on a carrier
#84Alloy formation control of transient liquid phase bonding
#85Method of transferring and bonding an array of micro devices
#86Method for producing a composite and a power semiconductor module
#87Semiconductor device using diffusion soldering
#88Miniaturized electrical component comprising an MEMS and an ASIC and production method
#89Elastic mounting of power modules
#90Semiconductor device including diffusion soldered layer on sintered silver layer
#91METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#92Method of Forming a Bonded Structure
#93Power module packaging with double sided planar interconnection and heat exchangers
#94Laminate electronic device
#95Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device
#96Bonding area design for transient liquid phase bonding process
#97BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#98Hermetically sealed wafer packages
#99Multi-component power structures and methods for forming the same
#100Device and method including a soldering process
#101Die-bonded LED
#102Mosfet package
#103BOND PACKAGE AND APPROACH THEREFOR
#104High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device
#105Method of making an electronic device
#106Submount
#107Semiconductor device
#108Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
#109Dry flux bonding device and method
#110Composite solder alloy preform
#111Stacked semiconductor chips with separate encapsulations
#112Electronic device package and method for fabricating the same
#113Semiconductor device
#114Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#115Preparation of metallurgic network compositions and methods of use thereof
#116Semiconductor device
#117Die-bonding method of LED chip and LED manufactured by the same
#118Power semiconductor module and method for operating a power semiconductor module
#119Laminate electronic device
#120Apparatus and method configured to lower thermal stresses
#121Semiconductor Device
#122Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#123Power semiconductor module and method for operating a power semiconductor module
#124Method of fabricating a high-temperature compatible power semiconductor module
#125Power semiconductor device and method for its production
#126METAL BONDED NANOTUBE ARRAY
#127Power semiconductor module with segmented base plate
#128High temperature, stable SiC device interconnects and packages having low thermal resistance
#129Self-assembly of components
#130Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#131Power semiconductor module including a multilayer substrate
#132TRANSIENT LIQUID PHASE EUTECTIC BONDING
#133Electronic device and method of manufacturing same
#134Semiconductor device including a transformer on chip
#135Stacked semiconductor chips with separate encapsulations
#136Semiconductor device and method
#137Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
#138LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT
#139Semiconductor Device
#140Submount and method of manufacturing the same
#141Method of manufacturing electronic device on leadframe
#142Device and method including a soldering process
#143SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME
#144Apparatus and method configured to lower thermal stresses
#145Electronic device
#146Semiconductor device
#147Electronic component with buffer layer
#148Semiconductor device with semiconductor chip and method for producing it
#149MULTILAYER PREFORM FOR FAST TRANSIENT LIQUID PHASE BONDING
#150Semiconductor device
#151LOW TEMPERATURE THERMAL INTERFACE MATERIALS
#152Semiconductor device including semiconductor chips having contact elements
#153Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#154Semiconductor device comprising a semiconductor chip stack and method for producing the same
#155Semiconductor module including semiconductor chips coupled to external contact elements
#156Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
#157Semiconductor module with multiple semiconductor chips
#158Electronic device and method for producing electronic devices
#159High temperature, stable SiC device interconnects and packages having low thermal resistance
#160Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#161MOSFET package
#162Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
#163Semiconductor chip, semiconductor device and methods for producing the same
#164Electronic assemblies having a low processing temperature
#165Diffusion soldered semiconductor device
#166Method for producing a dielectric layer for an electronic component
#167Electronic module with switching functions and method for producing the same
#168Nickel tin bonding system for semiconductor wafers and devices
#169Power semiconductor device connected in distinct layers of plastic
#170Method for producing a chip-substrate connection
#171Method of producing an electronic component
#172Power transistor and power semiconductor device
#173Vertical semiconductor power switch, electronic component and methods of producing the same
#174Power semiconductor device and method for producing it
#175Manufacturing method of semiconductor module including solid-liquid diffusion joining steps
#176Electronic module with stacked semiconductors
#177Power semiconductor component having chip stack
#178Electronic component and method for its assembly
#179Vertical power semiconductor component, semiconductor device and methods for the production thereof
#180Semiconductor device and method for producing the same
#181Semiconductor device
#182Semiconductor device comprising a vertical semiconductor component and method for producing the same
#183Method for the planar joining of components of semiconductor devices and a diffusion joining structure
#184Semiconductor component and methods to produce a semiconductor component
#185Electronic module and method of assembling the same
#186Semiconductor device
#187MOSFET package
#188MOSFET package
#189Semiconductor device
#190Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
#191Semiconductor device
#192Semiconductor device having surface mountable external contact areas and method for producing the same
#193MOSFET package
#194MOSFET package
#195Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment
#196Semiconductor device and manufacturing method thereof
#197High temperature, stable SiC device interconnects and packages having low thermal resistance
#198Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#199Power transistor including a leadframe and a semiconductor chip arranged on the leadframe
#200Method for producing chip stacks
#201Electronic assemblies having a low processing temperature
#202In-situ alloyed solders, articles made thereby, and processes of making same
#203Bonded assemblies
#204Semiconductor chip arrangement and method
#205Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#206[METHOD OF FORMING BOND MICROSTRUCTURE]
#207Diffusion solder position, and process for producing it
#208Micro-bonding structure