211352 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Soldering or alloying Diffusion bonding
Sub-classes:Method for Producing Molded Electronic Devices
#2Method for Attaching Metallic Bodies to Thin Semiconductor Dies at Wafer Level
#3SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICALLY AND MECHANICALLY COUPLING FIRST AND SECOND POWER SEMICONDUCTOR CHIPS TO A LEADFRAME PART AND METHOD FOR FABRICATING THEA SEMICONDUCTOR PACKAGE
#4ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE AS LATERAL EDGE PORTION OF SEMICONDUCTOR BODY
#5PACKAGE WITH LOW-WARPAGE CARRIER
#6Method for Fabricating a Power Semiconductor Device
#7Semiconductor package and method for fabricating a semiconductor package
#8Diffusion soldering with contaminant protection
#9SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
#10Diffusion soldering with contaminant protection
#11Power Semiconductor Device and Method for Fabricating a Power Semiconductor Device
#12Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip
#13Semiconductor package and method for fabricating a semiconductor package
#14Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#15Chip assembly
#16Process for forming an electric heater
#17Solder Preform for Diffusion Soldering, Method for the Production thereof, and Method for the Assembly Thereof
#18Encapsulated stress mitigation layer and power electronic assemblies incorporating the same
#19Semiconductor device and method of manufacturing a semiconductor device
#20Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making
#21Cooling bond layer and power electronics assemblies incorporating the same
#22Die-attach method to compensate for thermal expansion
#23Through-substrate-vias with self-aligned solder bumps
#24Through-substrate-vias with self-aligned solder bumps
#25Package with interconnections having different melting temperatures
#26Micro-transfer printing with volatile adhesive layer
#27Chip assembly
#28Semiconductor packages and methods of fabrication thereof
#29Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material
#30Methods and apparatuses for high temperature bonding and bonded substrates having variable porosity distribution formed therefrom
#31METAL PATCH, METHOD FOR MANUFACTURING THE SAME AND BONDING METHOD BY USING THE SAME
#32Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom
#33PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A METHOD FOR FORMING A PREFORM STRUCTURE FOR A SEMICONDUCTOR CHIP ARRANGEMENT, AND A METHOD FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT
#34Multi-step processes for high temperature bonding and bonded substrates formed therefrom
#35Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this method
#36Semiconductor device and manufacturing method of semiconductor device
#37Semiconductor package with multi-section conductive carrier
#38Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#39Integrated circuit bonding with interposer die
#40Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
#41Method of forming a chip assembly with a die attach liquid
#42Electronic module comprising a plurality of encapsulation layers and a method for producing it
#43Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
#44Batch process for connecting chips to a carrier
#45Chip package and chip assembly
#46Power semiconductor package with multi-section conductive carrier
#47Stacked semiconductor device and method of forming the same related cases
#48Semiconductor device
#49Semiconductor package with via-coupled power transistors
#50Method for manufacturing semiconductor devices having a metallisation layer
#51Semiconductor modules with semiconductor dies bonded to a metal foil
#52Method for coating and bonding substrates
#53Semiconductor apparatus
#54Electronic power device and method of fabricating an electronic power device
#55Multichip device including a substrate
#56Power semiconductor package with non-contiguous, multi-section conductive carrier
#57Joining method, method for producing electronic device and electronic part
#58Method for manufacturing semiconductor devices having a metallisation layer
#59Stacked semiconductor device and method of forming the same related cases
#60Light emitting device
#61Laminated composite made up of an electronic substrate and a layer arrangement comprising a reaction solder
#62Bonded structure with enhanced adhesion strength
#63Method of bonding semiconductor elements and junction structure
#64Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#65Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#66Power transistor arrangement and method for manufacturing the same
#67Semiconductor packages and methods of fabrication thereof
#68Adjustable pick-up head and method for manufacturing a device
#69Semiconductor package with conductive carrier integrated heat spreader
#70Chip package and a method for manufacturing a chip package
#71Electronic device and method of fabricating an electronic device
#72Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#73CHIP ARRANGEMENTS AND A METHOD FOR FORMING A CHIP ARRANGEMENT
#74Method of fabricating a power semiconductor chip package
#75Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package
#76Junction material, manufacturing method thereof, and manufacturing method of junction structure
#77Module including a discrete device mounted on a DCB substrate
#78Integrated circuit assembly and method of making
#79Semiconductor device including cladded base plate
#80Device including two power semiconductor chips and manufacturing thereof
#81Method for producing a power semiconductor arrangement
#82Fixing semiconductor die in dry and pressure supported assembly processes
#83Power semiconductor chip having two metal layers on one face
#84Semiconductor device including a contact clip having protrusions and manufacturing thereof
#85Semiconductor device including excess solder
#86Method for producing a metal layer on a substrate and device
#87Method for processing a semiconductor wafer or die, and particle deposition device
#88Die-bonded LED
#89Device including two semiconductor chips and manufacturing thereof
#90Method for bonding of chips on wafers
#91BOND PACKAGE AND APPROACH THEREFOR
#92Semiconductor module and method for production thereof
#93Power semiconductor chip package
#94Apparatus and method configured to lower thermal stresses
#95Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module
#96Method for manufacturing semiconductor devices having a metallisation layer
#97Circuit arrangement with shunt resistor
#98Method and system for forming a thin semiconductor device
#99Substrate having laser sintered underplate
#100Integrated circuit including bond wire directly bonded to pad
#101Bonded structure with enhanced adhesion strength
#102Semiconductor device
#103Die-bonding method of LED chip and LED manufactured by the same
#104Power semiconductor module and method for operating a power semiconductor module
#105Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#106Power semiconductor device and method for its production
#107Electronic device and method for fabricating the same
#108Power semiconductor module including a multilayer substrate
#109Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
#110Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
#111Semiconductor Device
#112Semiconductor device including semiconductor chips having contact elements
#113Integrated circuit device and method for the production thereof
#114Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
#115Semiconductor module with multiple semiconductor chips
#116Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
#117Method for producing a dielectric layer for an electronic component
#118Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
#119Power semiconductor device connected in distinct layers of plastic
#120Semiconductor component and method of assembling the same
#121Semiconductor device and manufacturing method thereof
#122Electronic device and method for fabricating the same
#123Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#124Semiconductor chip arrangement and method
#125Micro-bonding structure and method of forming the same
#126IC package with integrated inductor