Chip package

Padless die support integrated circuit package system

Wafer-level processing of chip-packaging compositions including bis-maleimides

Die-attaching paste composition and method for hardening the same

Chip package structure

Solder joint flip chip interconnection

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Semiconductor device having a semiconductor chip, and method for the production thereof

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Semiconductor packaging process and carrier for semiconductor package

Chip package structure and bumping process

Chip package structure and bumping process

Component mounting method and component-mounted body

Underfilled semiconductor die assemblies and methods of forming the same

Jig structure for manufacturin a stacked memory card

No flow underfill device and method

Process for exposing solder bumps on an underfill coated semiconductor

Method and apparatus for attaching microelectronic substrates and support members

Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate

Method and apparatus for attaching microelectronic substrates and support members

Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus

Electronic component unit

BUMP FOR OVERHANG DEVICE

Stacked memory card and method for manufacturing the same

Stack circuit member and method

Method of bonding a microelectronic die to a substrate and arrangement to carry out method

Method for making a flat-top pad

Surface protection film and method for producing the same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Electronic device and method for fabricating the same

Flip chip interconnection having narrow interconnection sites on the substrate

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

Die attach material for TBGA or flexible circuitry

Underfill encapsulant for wafer packaging and method for its application

Microfeature systems including adhered microfeature workpieces and support members

Methods of adhering microfeature workpieces, including a chip, to a support member

Package or pre-applied foamable underfill for lead-free process

Electronic device manufacture

Methods relating to forming interconnects

Foamable underfill encapsulant

Hot-Melt Underfill Composition and Methos of Application

Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

B-stageable underfill encapsulant and method for its application

Wafer-level underfill process making use of sacrificial contact pad protective material

Method for die attaching

Die attach material for TBGA or flexible circuitry

Adhesion apparatus

No-flow underfill materials for flip chips

Semiconductor device, circuit board, electro-optic device, electronic device

Method for flip chip bonding by utilizing an interposer with embedded bumps

Methods of making microelectronic packages with conductive elastomeric posts

Methods for marking a bare semiconductor die including applying a tape having energy-markable properties

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Method for attaching a semiconductor die to a substrate and heat spreader

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Wafer stacking package method

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method for processing a base that includes connecting a first base to a second base with an insulating film

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Semiconductor chip package manufacturing method including screen printing process

Semiconductor device having adhesion increasing film to prevent peeling

Method of attaching a leadframe to singulated semiconductor dice

Semiconductor assembly using dual-cure die attach adhesive

Method of connecting base materials

Electronic component mounting method and apparatus

Semiconductor flip-chip package and method for the fabrication thereof

Interposer including adhesive tape

Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Underfill fluxing curative

Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

Integrated circuit die and substrate coupling

Thin flip-chip method

Die to substrate attach using printed adhesive

Semiconductor device and method of manufacturing the same

Semiconductor component assemblies having interconnects

Semiconductor stack package and memory module with improved heat dissipation

Semiconductor device assembly process

Process for producing a semiconductor device

Electronic component mounting method and apparatus

Method for preparing arylphosphonite antioxidant

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bump-on-lead flip chip interconnection

Integrated circuit packaging system

Method of using pre-applied underfill encapsulant

Methods relating to forming interconnects and resulting assemblies

Head assembly, disk unit, and bonding method and apparatus

Electrical circuit assembly with improved shock resistance

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

Process of manufacturing a solder-fill for applying to semiconductor package

Non-linear amplitude dielectrophoresis waveform for cell fusion

Solder-fill application for mounting semiconductor chip on PCB

Method for manufacturing semiconductor devices

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Integrated underfill process for bumped chip assembly

Method and apparatus for attaching microelectronic substrates and support members

Method of surface-mounting semiconductor chip on PCB

Interlayer dielectric and pre-applied die attach adhesive materials