211360 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester; Hardening the adhesive by curing, i.e. thermosetting Localised curing of parts of the layer connector
MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
#2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
#3Method of manufacturing electronic device
#4Method For Manufacturing Led Display
#5Selectively bonding light-emitting devices via a pulsed laser
#6Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
#7Curing pre-applied and plasma-etched underfill via a laser
#8Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
#9Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
#10Laser assisted transfer welding process
#11Flip-chip assembly process comprising pre-coating interconnect elements
#12Electrically bonded arrays of transfer printed active components
#13Laser assisted transfer welding process
#14Stress-engineered interconnect packages with activator-assisted molds
#15Electronic circuit device and method for manufacturing same
#16Mounting method, electric part-mounted substrate and an electric device
#17Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties
#18Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#19Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#20Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film
#21Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#22Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#23Methods of reducing bleed-out of underfill and adhesive materials
#24Process for producing semiconductor device and semiconductor device