H01L2224/83897 - CPC Classification Index

ClassID:

211378 ⎘

H01L2224/83897 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like

Sub-classes:

H01L2224/83898 » Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other 6

Recent Application in this class:

20240363486

2024-10-31

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

20240297133

2024-09-05

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

20210272875

2021-09-02

Integrated circuit packages having mechanical brace standoffs

20210020593

2021-01-21

Integration and bonding of micro-devices into system substrate

20200185304

2020-06-11

Integrated circuit package and method

20190148321

2019-05-16

Integration and bonding of micro-devices into system substrate

20190103378

2019-04-04

Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement

20150140806

2015-05-21

Wafer-level die attach metallization

20130234313

2013-09-12

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

#10

20110198659

2011-08-18

Light emitting device and light unit having improved electrode and chip structures with concave/convex shapes

#11

20080191944

2008-08-14

Method For Establishing an Electrical and Mechanical Connection Between Chip Contact Surfaces and Antenna Contact Surfaces and Transponder