211379 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Bonding techniques; Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
Sub-classes:Micro device transferring method, and micro device substrate manufactured by micro device transferring method
#2Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#3Composite wafer including a molded wafer and a second wafer
#4Method for mounting a semiconductor chip on a carrier
#5Composite wafer including a molded wafer and a second wafer
#6Method for mounting a semiconductor chip on a carrier