211383 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector with the layer connector not providing any mechanical bonding; Pressing the layer connector against the bonding areas by means of another connector by means of another layer connector
SELECTIVE TRANSFER OF MICRO DEVICES
#2SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
#3SELECTIVE TRANSFER OF MICRO DEVICES
#4Selective micro device transfer to receiver substrate
#5Selective micro device transfer to receiver substrate
#6Selective micro device transfer to receiver substrate
#7Selective micro device transfer to receiver substrate
#8Selective micro device transfer to receiver substrate
#9Selective micro device transfer to receiver substrate
#10Selective transfer of micro devices
#11Selective micro device transfer to receiver substrate
#12Process for connecting joining parts
#13Micro-pillar assisted semiconductor bonding
#14Method of joining semiconductor substrate
#15Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card
#16Chip package and a method for manufacturing a chip package
#17Electronic component mounting structure