211385 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector with the layer connector not providing any mechanical bonding; Pressing the layer connector against the bonding areas by means of another connector by means of an encapsulation layer or foil
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#2Recessed semiconductor substrates and associated techniques
#3Coreless package structure and method for manufacturing same
#4Soldering method and method of manufacturing semiconductor device
#5STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
#6Stacked multi-die packages with impedance control
#7Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#8Recessed semiconductor substrates and associated techniques
#9TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
#10Bumpless flip-chip assembly with a complaint interposer contractor