H01L2224/83905 - CPC Classification Index

ClassID:

211386 ⎘

H01L2224/83905 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector Combinations of bonding methods provided for in at least two different groups from -

Sub-classes:

H01L2224/83906 » Specific sequence of method steps 17
H01L2224/83907 » Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step 122

Recent Application in this class:

20240379607

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

20230337364

PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT FILM

20230268308

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

20230060577

Connection structure and manufacturing method therefor

20210385950

Printed circuit film, display device, and method of fabricating printed circuit film

20210066233

Chemical mechanical polishing for hybrid bonding

20200294867

Assembly process for circuit carrier and circuit carrier

20200043888

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

20200043887

Semiconductor device, method for manufacturing the same, and power conversion device

20190189526

Placement method for circuit carrier and circuit carrier

20190096842

Chemical mechanical polishing for hybrid bonding

20170236799

Bonding method for connecting two wafers

20160343629

Wafer stack protection seal

20140264762

Wafer stack protection seal

20140216654

Electrically conductive adhesive compound and adhesive tape

20120118480

ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME

20110193217

Manufacturing of a device including a semiconductor chip

20110139856

Bonding structure and method for manufacturing same

20090242121

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT