211388 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector; Combinations of bonding methods provided for in at least two different groups from - Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#2MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#3SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
#4ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#5MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#6ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE BY USING SAME
#7METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECTION PARTNER
#8MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#9Micro device integration into system substrate
#10Chip assembly
#11Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
#12ROOM TEMPERATURE METAL DIRECT BONDING
#13A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use
#14METHOD FOR PERMANENT BONDING OF WAFERS
#15Micro device integration into system substrate
#16MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#17A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#18Die package component with jumper structure and manufacturing method thereof
#19Die package component with jumper structure
#20Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#21Semiconductor device including built-in crack-arresting film structure
#22Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method
#23Method for die and clip attachment
#24Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#25Method for manufacturing semiconductor device, semiconductor mounting device, and memory device manufactured by method for manufacturing semiconductor device
#26Micro-transfer printing with volatile adhesive layer
#27Chip assembly
#28Micro device integration into system substrate
#29Semiconductor device including built-in crack-arresting film structure
#30Adhesive film for semiconductor chip with through electrode
#31Semiconductor chip mounted on a packaging substrate
#32Die attachment for packaged semiconductor device
#33Anisotropic conductive film including oblique region having lower curing ratio
#34Underfill material, laminated sheet and method for producing semiconductor device
#35Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same
#36A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#37Semiconductor device including built-in crack-arresting film structure
#38Micro device integration into system substrate
#39Semiconductor device
#40Method and apparatus for chip-to-wafer integration
#41Die attachment for packaged semiconductor device
#42Method of forming a chip assembly with a die attach liquid
#43Method for permanent bonding of wafers
#44Room temperature metal direct bonding
#45Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
#46Adhesive for mounting flip chip for use in a method for producing a semiconductor device
#47Semiconductor device having a device fixed on a substrate with an adhesive
#48Underfill material and method for manufacturing semiconductor device using the same
#49Adhesive agent having a polyimide and acid modified rosin
#50Mounting method
#51Chip arranging method
#52Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method
#53Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
#54Method for bonding substrates
#55Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
#56Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
#57Semiconductor package and method of manufacturing the same
#58Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding
#59Room temperature metal direct bonding
#60Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
#61Semiconductor device and production method therefor
#62Semiconductor device and method for manufacturing thereof
#63Semiconductor device and production method therefor
#64Bonding material and bonding body, and bonding method
#65Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
#66Connecting elements for producing hybrid electronic circuits
#67Adhesive composition, an adhesive sheet and a production method of a semiconductor device
#68Adhesive composition, an adhesive sheet and a production method of a semiconductor device
#69Room temperature metal direct bonding
#70Method and apparatus for fabricating integrated circuit device using self-organizing function
#71MOUNTING METHOD AND MOUNTING DEVICE
#72Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit
#73Method for bonding of chips on wafers
#74ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE
#75Semiconductor device and method of forming composite bump-on-lead interconnection
#76Component arrangement and method for production thereof
#77Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner
#78METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION
#79Wafer-level packaged device having self-assembled resilient leads
#80Light emitting device and light unit having improved electrode and chip structures with concave/convex shapes
#81PRESSURE BONDING APPARATUS AND METHOD
#82ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS
#83METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE
#84Room temperature metal direct bonding
#85Method of manufacturing semiconductor device
#86Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
#87Process for producing a semiconductor device
#88SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#89MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#90Electronic component bonding method and apparatus using vibration energy
#91Semiconductor device and production method therefor
#92Semiconductor device and production method therefor
#93Semiconductor electronic component and semiconductor device using the same
#94Electronic device and method for fabricating the same
#95Adhesive tape and semiconductor device using the same
#96Flip chip MLP with conductive ink
#97Semiconductor device and method of forming composite bump-on-lead interconnection
#98Semiconductor chip assembly
#99Compression bonding device
#100Semiconductor device and method for manufacturing thereof
#101Combined metallic bonding and molding for electronic assemblies including void-reduced underfill
#102Semiconductor device including a pressure-contact section
#103SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF
#104Bonding method of semiconductor and laminated structure fabricated thereby
#105Semiconductor device and manufacturing method for the same
#106Flip chip interconnection
#107Compression bonding device and a mounting method
#108Method of manufacturing a contact arrangement between a microelectronic component and a carrier
#109Methods of attaching a die to a substrate
#110Method and apparatus for fabricating integrated circuit device using self-organizing function
#111Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween
#112Methods for attaching microfeature dies to external devices
#113Method of manufacturing an integrated circuit
#114SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#115INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#116Room temperature metal direct bonding
#117Method for diffusion soldering
#118Flip chip MLP with conductive ink
#119Integrated electronic chip and interconnect device and process for making the same
#120Contact structure and method for manufacturing the same
#121Electronic device and method for fabricating the same
#122Process of bonding circuitry components
#123Room temperature metal direct bonding
#124Method for producing an electronic device connected to a printed circuit board
#125INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#126Method of fabricating integrated electronic chip with an interconnect device