211414 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the strap connector during or after the bonding process
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
#2SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE
#4INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS
#5Multi-clip structure for die bonding
#6Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#7Coated electrical assembly
#8Semiconductor module package and method of manufacturing the same