H01L2224/84 - CPC Classification Index

ClassID:

211410 ⎘

H01L2224/84 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector

Sub-classes:

H01L2224/84001 » involving a temporary auxiliary member not forming part of the bonding apparatus 2
H01L2224/84007 » involving a permanent auxiliary member being left in the finished device e.g. aids for holding or protecting the strap connector during or after the bonding process 8
H01L2224/84009 » Pre-treatment of the connector and/or the bonding area 4
H01L2224/84053 » Bonding environment 0
H01L2224/841 » the connector being supplied to the parts to be connected in the bonding apparatus 4
H01L2224/8411 » involving protection against electrical discharge, e.g. removing electrostatic charge 1
H01L2224/8412 » Aligning 3
H01L2224/842 » Applying energy for connecting 0
H01L2224/8434 » Bonding interfaces of the connector 0
H01L2224/8436 » Bonding interfaces of the semiconductor or solid state body 0
H01L2224/8438 » Bonding interfaces outside the semiconductor or solid-state body 0
H01L2224/848 » Bonding techniques 5
H01L2224/849 » involving monitoring, e.g. feedback loop 3
H01L2224/84909 » Post-treatment of the connector or bonding area 0
H01L2224/84986 » Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence 3

Recent Application in this class:

20250275485

2025-08-28

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG AND ISOLATION

20240128167

2024-04-18

MONOLITHIC MULTIPLE-CHANNEL PROTECTION DEVICE

20240096768

2024-03-21

SEMICONDUCTOR PACKAGE HAVING REDUCED PARASITIC INDUCTANCE

20230154883

2023-05-18

SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE BOND PADS OF THE SEMICONDUCTOR DIE

20200068735

2020-02-27

Power semiconductor device and power conversion device

20190013249

2019-01-10

Damaging components with defective electrical couplings

20180303001

2018-10-18

Power semiconductor device and power conversion device

20180138112

2018-05-17

POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE POWER APPLICATIONS

20180096918

2018-04-05

Lead and lead frame for power package

#10

20170365518

2017-12-21

SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS

#11

20170271304

2017-09-21

Dual lead frame semiconductor package and method of manufacture

#12

20170062318

2017-03-02

Sintered conductive matrix material on wire bond

#13

20150357304

2015-12-10

Flip chip assembly and process with sintering material on metal bumps

#14

20140070226

2014-03-13

Bondable top metal contacts for gallium nitride power devices

#15

20140036464

2014-02-06

Integrated system and method of making the integrated system

#16

20130200532

2013-08-08

Semiconductor device using diffusion soldering

#17

20130181228

2013-07-18

Power semiconductor module and method of manufacturing the same

#18

20130154073

2013-06-20

Method of forming a semiconductor device and leadframe therefor

#19

20130146991

2013-06-13

Device including two power semiconductor chips and manufacturing thereof

#20

20130119907

2013-05-16

Power module with current routing

#21

20130033300

2013-02-07

Semiconductor device having at least a transistor cell with a second conductive type region surrounding a wall region and being insulated from both gate electrode and source electrode and solid state relay using same

#22

20130027113

2013-01-31

Power semiconductor chip having two metal layers on one face

#23

20130026490

2013-01-31

Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages

#24

20130023089

2013-01-24

LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE

#25

20130009297

2013-01-10

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

#26

20130009296

2013-01-10

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

#27

20130009295

2013-01-10

Semiconductor device including a contact clip having protrusions and manufacturing thereof

#28

20120330459

2012-12-27

Transport method and transport apparatus

#29

20120322207

2012-12-20

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

#30

20120313239

2012-12-13

Flip chip assembly and process with sintering material on metal bumps

#31

20120313232

2012-12-13

Power package including multiple semiconductor devices

#32

20120306328

2012-12-06

Semiconductor device and driving apparatus including semiconductor device

#33

20120306299

2012-12-06

Semiconductor module and driving apparatus including semiconductor module

#34

20120280247

2012-11-08

High voltage cascoded III-nitride rectifier package utilizing clips on package surface

#35

20120267682

2012-10-25

Semiconductor device

#36

20120262100

2012-10-18

Bondwireless power module with three-dimensional current routing

#37

20120248593

2012-10-04

Package structure for DC-DC converter

#38

20120248592

2012-10-04

Lead component and method for manufacturing the same, and semiconductor package

#39

20120248539

2012-10-04

Flip chip semiconductor device

#40

20120235289

2012-09-20

Power device with bottom source electrode

#41

20120218318

2012-08-30

Light emitting apparatus, illumination apparatus and display apparatus

#42

20120217626

2012-08-30

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#43

20120193695

2012-08-02

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

#44

20120181996

2012-07-19

Multi chip module, method for operating the same and DC/DC converter

#45

20120168919

2012-07-05

Semiconductor package and method of fabricating the same

#46

20120112331

2012-05-10

Dual lead frame semiconductor package and method of manufacture

#47

20120098117

2012-04-26

POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE

#48

20120098090

2012-04-26

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

#49

20120074428

2012-03-29

Semiconductor module including a switch and non-central diode

#50

20120064781

2012-03-15

Connector assembly and method of manufacture

#51

20120063107

2012-03-15

Semiconductor component and method of manufacture

#52

20120061813

2012-03-15

Package structure for DC-DC converter

#53

20120056277

2012-03-08

Semiconductor device integrated with converter and package structure thereof

#54

20120049336

2012-03-01

Semiconductor package for forming a leadframe package

#55

20120032244

2012-02-09

Compact semiconductor package with integrated bypass capacitor

#56

20120014059

2012-01-19

Power module

#57

20120013260

2012-01-19

Light emitting device with light emitting cells arrayed

#58

20120001342

2012-01-05

Internal packaging of a semiconductor device mounted on die pads

#59

20110316135

2011-12-29

Semiconductor device attached to island having protrusion

#60

20110310585

2011-12-22

Power semiconductor device and power conversion device

#61

20110309454

2011-12-22

Combined packaged power semiconductor device

#62

20110298115

2011-12-08

Semiconductor component and method of manufacture

#63

20110291286

2011-12-01

Electronic device and method for connecting a die to a connection terminal

#64

20110285336

2011-11-24

Semiconductor module device and driving apparatus having the same

#65

20110285226

2011-11-24

Semiconductor module device and driving apparatus having the same

#66

20110241170

2011-10-06

Monolithic semiconductor switches and method for manufacturing

#67

20110227207

2011-09-22

Stacked dual chip package and method of fabrication

#68

20110227205

2011-09-22

Multi-layer lead frame package and method of fabrication

#69

20110210708

2011-09-01

High Frequency Power Supply Module Having High Efficiency and High Current

#70

20110193208

2011-08-11

Semiconductor package of a flipped MOSFET and its manufacturing method

#71

20110163432

2011-07-07

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#72

20110163431

2011-07-07

Semiconductor device and method of manufacturing the same

#73

20110121461

2011-05-26

Semiconductor device and method of packaging a semiconductor device with a clip

#74

20110115062

2011-05-19

Semiconductor device and method of manufacturing the same

#75

20110109287

2011-05-12

SEMICONDUCTOR PACKAGE AND DC-DC CONVERTER

#76

20110095409

2011-04-28

Method of attaching an interconnection plate to a semiconductor die within a leadframe package

#77

20110073921

2011-03-31

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

#78

20110070698

2011-03-24

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

#79

20110068457

2011-03-24

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

#80

20110049692

2011-03-03

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

#81

20110037148

2011-02-17

Package-level integrated circuit connection without top metal pads or bonding wire

#82

20110033724

2011-02-10

Tie-bar configuration for leadframe type carrier strips

#83

20110024886

2011-02-03

Semiconductor device package having features formed by stamping

#84

20110024884

2011-02-03

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

#85

20100328901

2010-12-30

Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same

#86

20100319876

2010-12-23

Semiconductor element cooling structure

#87

20100308457

2010-12-09

Semiconductor apparatus and manufacturing method of the same

#88

20100297810

2010-11-25

Power semiconductor device and method for its production

#89

20100289127

2010-11-18

Semiconductor device

#90

20100276797

2010-11-04

Semiconductor device

#91

20100273294

2010-10-28

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

#92

20100270992

2010-10-28

SEMICONDUCTOR DEVICE

#93

20100258945

2010-10-14

Semiconductor device and method for manufacturing the same

#94

20100224982

2010-09-09

Lead and lead frame for power package

#95

20100168908

2010-07-01

Transport method and transport apparatus

#96

20100148327

2010-06-17

Semiconductor die package with clip interconnection

#97

20100133674

2010-06-03

Compact semiconductor package with integrated bypass capacitor and method

#98

20100127277

2010-05-27

Semiconductor module including a switch and non-central diode

#99

20100109147

2010-05-06

Less expensive high power plastic surface mount package

#100

20100065961

2010-03-18

Electronic device and method of manufacturing same

#101

20100059875

2010-03-11

Semiconductor device

#102

20100032825

2010-02-11

Flange package for a semiconductor device

#103

20100032819

2010-02-11

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

#104

20100013086

2010-01-21

Power semiconductor device

#105

20090261462

2009-10-22

SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY

#106

20090250796

2009-10-08

Semiconductor device package having features formed by stamping

#107

20090190320

2009-07-30

Semiconductor device

#108

20090189266

2009-07-30

Semiconductor package with stacked dice for a buck converter

#109

20090179315

2009-07-16

Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same

#110

20090152697

2009-06-18

Semiconductor device and manufacturing method of the same

#111

20090128968

2009-05-21

Stacked-die package for battery power management

#112

20090108392

2009-04-30

Semiconductor structure and method of manufacture

#113

20090079092

2009-03-26

Stacked dual-die packages, methods of making, and systems incorporating said packages

#114

20090051018

2009-02-26

Semiconductor component

#115

20090026560

2009-01-29

Sensor package

#116

20090016088

2009-01-15

Semiconductor assembly

#117

20080297138

2008-12-04

Current sensor

#118

20080242057

2008-10-02

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

#119

20080224323

2008-09-18

Semiconductor module with multiple semiconductor chips

#120

20080224315

2008-09-18

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#121

20080218098

2008-09-11

Light emitting device with light emitting cells arrayed

#122

20080111219

2008-05-15

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

#123

20080061431

2008-03-13

Power semiconductor module

#124

20080054449

2008-03-06

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

#125

20080017882

2008-01-24

Power semiconductor apparatus

#126

20070284720

2007-12-13

Power semiconductor device connected in distinct layers of plastic

#127

20070200537

2007-08-30

Semiconductor device

#128

20070182384

2007-08-09

Vehicle Rotating Electric Machine

#129

20070138610

2007-06-21

Semiconductor package structure and method of manufacture

#130

20070132073

2007-06-14

DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR

#131

20070123073

2007-05-31

Semiconductor devices with conductive clips

#132

20070051974

2007-03-08

Semiconductor device and power conversion apparatus using the same

#133

20070042568

2007-02-22

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

#134

20070035019

2007-02-15

Semiconductor component and method of manufacture

#135

20060284291

2006-12-21

Lead frame structure with aperture or groove for flip chip in a leaded molded package

#136

20060273380

2006-12-07

Source contact and metal scheme for high density trench MOSFET

#137

20060219436

2006-10-05

CURRENT SENSOR

#138

20060181263

2006-08-17

Current sensor

#139

20060049505

2006-03-09

High density interconnect power and ground strap and method therefor

#140

20060043613

2006-03-02

Surface-mounting semiconductor device and method of making the same

#141

20050248336

2005-11-10

Current sensor

#142

20050237033

2005-10-27

Vehicle rotating electric machine

#143

20050133893

2005-06-23

Lead frame structure with aperture or groove for flip chip in a leaded molded package

#144

20050063129

2005-03-24

Static electricity protective circuit and high-frequency circuit apparatus incorporating the same