H01L2224/84136 - CPC Classification Index

ClassID:

211460 ⎘

H01L2224/84136 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Aligning involving guiding structures, e.g. spacers or supporting members

Sub-classes:

H01L2224/84138 » the guiding structures being at least partially left in the finished device 22

Recent Application in this class:

20190131216

2019-05-02

Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad

20160148859

2016-05-26

Semiconductor device and manufacturing method thereof

20150270207

2015-09-24

Semiconductor module package and method of manufacturing the same

20130256852

2013-10-03

Process of making a stacked semiconductor package having a clip