H01L2224/8436 - CPC Classification Index

ClassID:

211489 ⎘

H01L2224/8436 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector Bonding interfaces of the semiconductor or solid state body

Sub-classes:

H01L2224/84365 » Shape, e.g. interlocking features 0
H01L2224/84375 » having an external coating, e.g. protective bond-through coating 1
H01L2224/84379 » Material 2