ClassID:

211508

H01L2224/84494 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector; Bonding interfaces outside the semiconductor or solid-state body; Material with a principal constituent of the material being a liquid not provided for in groups  -