211568 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Pre-treatment of the connector or the bonding area; Cleaning, e.g. oxide removal step, desmearing Chemical cleaning, e.g. etching, flux
Semiconductor device and method of manufacturing semiconductor device
#2Direct selective adhesion promotor plating
#3METHOD AND REAGENT FOR TREATING BARE COPPER WIRE AND SURFACE-TREATED COPPER WIRE
#4Direct selective adhesion promotor plating
#5Method for treating a bond pad of a package substrate
#6Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer
#7Immersion method
#8COPPER PAD FOR COPPER WIRE BONDING
#9Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer
#10Coated lead frame
#11Leadframe treatment for enhancing adhesion of encapsulant thereto
#12Electronic component built-in substrate and method of manufacturing electronic component built-in substrate
#13Wire and solder bond forming methods
#14Wire and solder bond forming methods
#15Semiconductor device with front side metallization and method for the production thereof
#16Immersion method
#17Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon