H01L2224/8501 - CPC Classification Index

ClassID:

211567 ⎘

H01L2224/8501 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Pre-treatment of the connector or the bonding area Cleaning, e.g. oxide removal step, desmearing

Sub-classes:

H01L2224/85011 » Chemical cleaning, e.g. etching, flux 17
H01L2224/85012 » Mechanical cleaning, e.g. abrasion using hydro blasting, brushes, ultrasonic cleaning, dry ice blasting, gas-flow 4
H01L2224/85013 » Plasma cleaning 53
H01L2224/85014 » Thermal cleaning, e.g. decomposition, sublimation 3
H01L2224/85017 » Electron beam cleaning 1
H01L2224/85019 » Combinations of two or more cleaning methods provided for in at least two different groups from to 0

Recent Application in this class:

20180218996

2018-08-02

Method For Producing Wire Bond Connection And Arrangement For Implementing The Method

20180005910

2018-01-04

Repackaged integrated circuit assembly method

20160372402

2016-12-22

Mixed impedance leads for die packages and method of making the same

20160329294

2016-11-10

Ball bonding metal wire bond wires to metal pads

20160225686

2016-08-04

Repackaged integrated circuit and assembly method

20140110838

2014-04-24

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

20130330852

2013-12-12

Manufacturing method of light-emitting device

20110316160

2011-12-29

Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate

20110316130

2011-12-29

Thin semiconductor package and method for manufacturing same

#10

20100009517

2010-01-14

Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor

#11

20090218652

2009-09-03

Device comprising electrode pad

#12

20090166861

2009-07-02

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

#13

20090152687

2009-06-18

Method of opening pad in semiconductor device

#14

20090068847

2009-03-12

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

#15

20090053850

2009-02-26

METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE

#16

20090046183

2009-02-19

Solid state imaging device and manufacturing method thereof

#17

20080197168

2008-08-21

Wire cleaning guide

#18

20080174029

2008-07-24

SEMICONDUCTOR DEVICE AND METHOD OF FORMING METAL PAD OF SEMICONDUCTOR DEVICE

#19

20080102556

2008-05-01

Method of manufacturing complementary metal oxide semiconductor image sensor

#20

20080093729

2008-04-24

Semiconductor module arrangement

#21

20080023525

2008-01-31

Bonding apparatus

#22

20070071900

2007-03-29

Methods for protecting metal surfaces

#23

20070015352

2007-01-18

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

#24