ClassID:

211573

H01L2224/85017 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Pre-treatment of the connector or the bonding area; Cleaning, e.g. oxide removal step, desmearing Electron beam cleaning

Recent Application in this class: