211580 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Pre-treatment of the connector or the bonding area; Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a laser
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
#2Method for processing an ultra-high density space interconnect lead under light source guidance
#3Semiconductor module and method for manufacturing the same
#4Electronic device by laser-induced forming and transfer of shaped metallic interconnects
#5SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS
#6Processes for IC fabrication
#7METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
#8Methods and systems for laser assisted wirebonding