211578 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Pre-treatment of the connector or the bonding area; Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
Sub-classes:METHOD OF FORMING AN ELECTRICAL CONNECTION AND ELECTRICAL CONNECTION
#2METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BONDING TOOLS
#3WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
#4Methods of forming wire interconnect structures and related wire bonding tools
#5BONDING WIRE FOR SEMICONDUCTOR DEVICES
#6BONDING WIRE FOR SEMICONDUCTOR DEVICES
#7Package structure and method for fabricating the same
#8BONDING WIRE FOR SEMICONDUCTOR DEVICES
#9Bonding wire for semiconductor devices
#10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#11Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
#12Semiconductor device packages with high angle wire bonding and non-gold bond wires
#13Package structure and method for fabricating the same
#14Methods of forming wire interconnect structures and related wire bonding tools
#15Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
#16Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof
#17Wire bond capillary design
#18Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
#19Package structure and method for fabricating the same
#20Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#21Package structure and method for fabricating the same
#22Semiconductor device and method for manufacturing same
#23Semiconductor device and method for manufacturing the same
#24Semiconductor device and method for manufacturing the same
#25Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#26Copper wire and electrode joining method and joint structure
#27Corrosion-resistant copper bonds to aluminum
#28Patterns of passivation material on bond pads and methods of manufacture thereof