ClassID:

211581

H01L2224/85041 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Pre-treatment of the connector or the bonding area; Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" Induction heating, i.e. eddy currents