H01L2224/85053 - CPC Classification Index

ClassID:

211587 ⎘

H01L2224/85053 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector Bonding environment

Sub-classes:

H01L2224/85054 » Composition of the atmosphere 6
H01L2224/85085 » being a liquid, e.g. for fluidic self-assembly 1
H01L2224/8509 » Vacuum 2
H01L2224/85091 » Under pressure 3
H01L2224/85095 » Temperature settings 1