211594 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding environment Under pressure
Sub-classes:SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#2PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
#3SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#4WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE