H01L2224/85097 - CPC Classification Index

ClassID:

211599 ⎘

H01L2224/85097 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding environment; Temperature settings; Transient conditions Heating

Recent Application in this class:

20240194634

2024-06-13

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

20120231583

2012-09-13

DIE-BONDING FILM AND USE THEREOF

20120126379

2012-05-24

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM

20110120614

2011-05-26

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM