H01L2224/85099 - CPC Classification Index

ClassID:

211601 ⎘

H01L2224/85099 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding environment; Temperature settings Ambient temperature

Recent Application in this class:

20230148306

2023-05-11

BONDING WIRE FOR SEMICONDUCTOR DEVICES

20180345019

2018-12-06

CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL STIMULATION

20150380344

2015-12-31

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

20150303166

2015-10-22

Wire bonding apparatus

20150294926

2015-10-15

Module comprising a semiconductor chip

20140179063

2014-06-26

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

20140151866

2014-06-05

Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress

20140151717

2014-06-05

Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device

20130292856

2013-11-07

Method for the wafer-level integration of shape memory alloy wires

#10

20120296444

2012-11-22

Cortical interface for motor signal recording and sensory signal stimulation

#11

20120276693

2012-11-01

Module comprising a semiconductor chip

#12

20120032354

2012-02-09

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS

#13

20120031955

2012-02-09

Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

#14

20110291253

2011-12-01

LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF

#15

20110062596

2011-03-17

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

#16

20110057018

2011-03-10

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

#17

20100213613

2010-08-26

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

#18

20100201280

2010-08-12

Electrically isolated vertical light emitting diode structure

#19

20100108359

2010-05-06

Connecting wire and method for manufacturing same

#20

20100065963

2010-03-18

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

#21

20100059255

2010-03-11

Method for producing an LTCC substrate

#22

20100052174

2010-03-04

COPPER PAD FOR COPPER WIRE BONDING

#23

20100052125

2010-03-04

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

#24

20090178830

2009-07-16

Printed circuit board and component package having the same

#25

20090091013

2009-04-09

Lead frame, electronic component including the lead frame, and manufacturing method thereof

#26

20090079042

2009-03-26

Center Conductor to Integrated Circuit for High Frequency Applications

#27

20080230928

2008-09-25

Module comprising a semiconductor chip

#28

20080213943

2008-09-04

Thermosetting die bonding film

#29

20080211091

2008-09-04

Power semiconductor module and method for producing the same

#30

20080105935

2008-05-08

Micromachine Device

#31

20080073786

2008-03-27

Semiconductor device and method of manufacturing the same

#32

20070224805

2007-09-27

Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip

#33

20070161157

2007-07-12

Semiconductor device package and method for manufacturing same

#34

20070001283

2007-01-04

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

#35

20060220231

2006-10-05

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

#36

20060011710

2006-01-19

Formation of a wire bond with enhanced pull

#37

20050150932

2005-07-14

Arrangement for wire bonding and method for producing a bonding connection

#38

20050082679

2005-04-21

Semiconductor component and production method suitable therefor

#39

20050030823

2005-02-10

Electronic circuit device