H01L2224/85121 - CPC Classification Index

ClassID:

211605 ⎘

H01L2224/85121 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Aligning Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors

Sub-classes:

H01L2224/85122 » by detecting inherent features of, or outside, the semiconductor or solid-state body 3
H01L2224/8513 » using marks formed on the semiconductor or solid-state body 14
H01L2224/85132 » using marks formed outside the semiconductor or solid-state body, i.e. “off-chip” 7

Recent Application in this class:

20190287946

2019-09-19

Signal routing in complex quantum systems

20190164935

2019-05-30

System and method for routing signals in complex quantum systems

20180254267

2018-09-06

Method of manufacturing a semiconductor device

20170154864

2017-06-01

Bonding apparatus and method of estimating position of landing point of bonding tool

20150255444

2015-09-10

Semiconductor device, method of manufacturing a semiconductor device, and positioning jig

20130299983

2013-11-14

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

20120228781

2012-09-13

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

20120024089

2012-02-02

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

20110174865

2011-07-21

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

#10

20110114704

2011-05-19

Bonding apparatus and bonding method

#11

20100264521

2010-10-21

Semiconductor component having through wire interconnect (TWI) with compressed wire

#12

20100181365

2010-07-22

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

#13

20090124028

2009-05-14

Imaging device and method for a bonding apparatus

#14

20090078743

2009-03-26

Wire bonding system utilizing multiple positioning tables

#15

20090059361

2009-03-05

Imaging device and method for a bonding apparatus

#16

20090001572

2009-01-01

Semiconductor device and method of manufacturing the same

#17

20080093004

2008-04-24

Electronic device handler for a bonding apparatus

#18

20080042247

2008-02-21

Stacked semiconductor components with through wire interconnects (TWI)

#19

20070230771

2007-10-04

Method of correcting bonding coordinates using reference bond pads

#20

20070167000

2007-07-19

Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)

#21

20070126091

2007-06-07

Semiconductor components having through wire interconnects (TWI)

#22

20070063318

2007-03-22

Method for producing bonding connection of semiconductor device

#23

20070041632

2007-02-22

Bonding program

#24

20070036425

2007-02-15

Bonding apparatus

#25

20060261495

2006-11-23

Semiconductor device and method of manufacturing the same

#26

20060246648

2006-11-02

Alignment key structure in a semiconductor device and method of forming the same

#27

20060128040

2006-06-15

BOND POSITIONING METHOD FOR WIRE-BONDING PROCESS AND SUBSTRATE FOR THE BOND POSITIONING METHOD

#28

20060001157

2006-01-05

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

#29

20050167471

2005-08-04

Bonding method, bonding apparatus and bonding program