211611 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Aligning; Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
#2METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED BY THE SAME
#3Semiconductor devices including recognition marks
#4Method of manufacturing semiconductor device
#5Semiconductor device and method of manufacturing the same
#6Method of chip positioning for multi-chip packaging
#7METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME
#8Bonding program
#9Bonding apparatus
#10Bonding pattern discrimination device
#11Bonding pattern discrimination program
#12Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
#13Bonding method, bonding apparatus and bonding program
#14Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
#15Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate