211621 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge Rotational movements
Method for fabricating wire bonding structure
#2Inclusion of chip elements in a sheathed wire
#3Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
#4Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
#5Semiconductor device with wire bond inductor and method