H01L2224/8538 - CPC Classification Index

ClassID:

211646 ⎘

H01L2224/8538 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector Bonding interfaces outside the semiconductor or solid-state body

Sub-classes:

H01L2224/85385 » Shape, e.g. interlocking features 62
H01L2224/85395 » having an external coating, e.g. protective bond-through coating 11
H01L2224/85399 » Material 1,4K

Recent Application in this class:

20170323841

2017-11-09

Electronic device provided with an integral conductive wire and method of manufacture

20170092557

2017-03-30

Electronic device provided with an integral conductive wire and method of manufacture

20160372446

2016-12-22

Low profile integrated circuit (IC) package comprising a plurality of dies

20160293569

2016-10-06

Semiconductor device manufacturing method