211649 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding interfaces outside the semiconductor or solid-state body Material
Sub-classes:PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
#2SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMICONDUCTOR DEVICES
#3STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#4STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#5Package-on-package assembly with wire bond vias
#6SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS DISPOSED
#7Semiconductor device packages, packaging methods, and packaged semiconductor devices
#8Hybrid embedded packaging structure and manufacturing method thereof
#9Semiconductor device packages, packaging methods, and packaged semiconductor devices
#10Package-on-package assembly with wire bond vias
#11Stacked semiconductor die assemblies with support members and associated systems and methods
#12Stacked semiconductor die assemblies with die support members and associated systems and methods
#13Package-on-package assembly with wire bond vias
#14Stacked semiconductor die assemblies with die support members and associated systems and methods
#15Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#16SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#17Stacked semiconductor die assemblies with support members and associated systems and methods
#18Integrated circuit package including miniature antenna
#19Semiconductor device packages, packaging methods, and packaged semiconductor devices
#20Semiconductor device with lead terminals having portions thereof extending obliquely
#21Semiconductor device and method for manufacturing semiconductor device
#22Method of making a wire support leadframe for a semiconductor device
#23Semiconductor device and method for manufacturing semiconductor device
#24Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#25Multichip modules and methods of fabrication
#26On-bonder automatic overhang die optimization tool for wire bonding and related methods
#27Wire support for a leadframe
#28CORTICAL INTERFACE FOR MOTOR SIGNAL RECORDING AND SENSORY SIGNAL STIMULATION
#29Integrated circuit package including miniature antenna
#30Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#31Semiconductor device packages, packaging methods, and packaged semiconductor devices
#32Adjustable losses on bond wire arrangement
#33Stacked semiconductor die assemblies with die support members and associated systems and methods
#34Method of making a wire support leadframe for a semiconductor device
#35Light emitting element
#36Semiconductor device with lead terminals having portions thereof extending obliquely
#37Semiconductor device
#38Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#39Package-on-package assembly with wire bond vias
#40Wire support for a leadframe
#41Flexible electronic system with wire bonds
#42Semiconductor device and method for manufacturing semiconductor device
#43Compact semiconductor package and related methods
#44Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#45Semiconductor device
#46Semiconductor device with lead terminals having portions thereof extending obliquely
#47Stacked semiconductor die assemblies with support members and associated systems and methods
#48Semiconductor device
#49Stacked semiconductor die assemblies with die support members and associated systems and methods
#50Adjustable losses of bond wire arrangement
#51Off substrate kinking of bond wire
#52Compact semiconductor package and related methods
#53Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#54Systems and methods for high-speed, low-profile memory packages and pinout designs
#55Semiconductor device with step portion having shear surfaces
#56Fabrication method of semiconductor device, evaluation method of semiconductor device, and semiconductor device
#57Stacked semiconductor die assemblies with die support members and associated systems and methods
#58Stacked semiconductor die assemblies with support members and associated systems and methods
#59Binding wire and semiconductor package structure using the same
#60Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
#61Nonvolatile memory device having authentication, and methods of operation and manufacture thereof
#62Integrated circuit package including miniature antenna
#63Integrated electronic device including an interposer structure and a method for fabricating the same
#64Wire bonding apparatus
#65Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#66Semiconductor device and method for manufacturing semiconductor device
#67Semiconductor devices and methods of making semiconductor devices
#68Combined QFN and QFP semiconductor package
#69Semiconductor device with output circuit and pad arrangements
#70Power semiconductor device
#71Conductive pads and methods of formation thereof
#72Heat management in electronics packaging
#73Flexible electronic system with wire bonds
#74Wire bonding method employing two scrub settings
#75Structure for aluminum pad metal under ball bond
#76Package-on-package assembly with wire bond vias
#77Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#78Semiconductor device with lead terminals having portions thereof extending obliquely
#79Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor package
#80Semiconductor device and connection checking method for semiconductor device
#81Semiconductor device and method for producing the same
#82Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#83Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#84Segmented bond pads and methods of fabrication thereof
#85Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#86Wafer scale technique for interconnecting vertically stacked dies
#87System and method of sensing current in a power semiconductor device
#88Integrated circuit device and electronic apparatus
#89Semiconductor device including dummy pattern
#90Waterfall wire bonding
#91OLED device in contact with a conductor
#92Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
#93High frequency device
#94Packaged microelectronic components
#95Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
#96Power semiconductor housing with redundant functionality
#97Semiconductor device and programming method
#98Embedded package security tamper mesh
#99Component and method of manufacturing a component using an ultrathin carrier
#100MULTI-CORE WIRE
#101Multi-chip package with offset die stacking and method of making same
#102Method for the wafer-level integration of shape memory alloy wires
#103Chip assembly and chip assembling method
#104Semiconductor device including a polymer disposed on a carrier
#105Lead frame with grooved lead finger
#106Integrated circuit package and method of assembling an integrated circuit package
#107Integrated Circuit Device With Wire Bond Connections
#108Package carrier and manufacturing method thereof
#109Integrated circuit packages having redistribution structures
#110Packaged leadless semiconductor device
#111Semiconductor package
#112Device having multiple wire bonds for a bond area and methods thereof
#113Integrated circuit having staggered bond pads and I/O cells
#114Thermal pad shorts test for wire bonded strip testing
#115Method and apparatus for monitoring free air ball (FAB) formation in wire bonding
#116Package-on-package assembly with wire bond vias
#117Package-on-package assembly with wire bond vias
#118Package-on-package assembly with wire bond vias
#119DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME
#120Semiconductor structure and method for making same
#121Low loop wire bonding
#122Semiconductor device including cladded base plate
#123Semiconductor chip
#124Electronic component and method for producing same
#125Semiconductor chip with bonding wire and method for making the same
#126Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
#127Chip-stacked semiconductor package
#128Power semiconductor module
#129Optoelectronic component and method for producing an optoelectronic component
#130APPARATUS AND METHOD FOR TREATING A SUBSTRATE
#131Semiconductor device
#132Cortical interface for motor signal recording and sensory signal stimulation
#133Pad layout structure of semiconductor chip
#134Apparatus and methods for electronic amplification
#135Semiconductor device and a manufacturing method thereof
#136SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1373D interconnection structure and method of manufacturing the same
#138Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
#139Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
#140LED PACKAGE AND METHOD FOR MANUFACTURING SAME
#141SEMICONDUCTOR DEVICE
#142Compact low-flare solid-state imaging apparatus and electronic system comprising a compact low-flare solid-state imaging apparatus
#143Short and low loop wire bonding
#144Integrated Circuit Package Security Fence
#145Integrated circuit package including miniature antenna
#146Flip chip semiconductor device
#147Packaged semiconductor assemblies and methods for manufacturing such assemblies
#148Integrated circuit packaging system with interconnects and method of manufacture thereof
#149SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
#150Protecting element having first and second high concentration impurity regions separated by insulating region
#151III-nitride transistor stacked with FET in a package
#152Wiring pattern having a stub wire
#153Semiconductor apparatus, manufacturing apparatus, and manufacturing method
#154LED module
#155SURGE PROTECTION DEVICE
#156Semiconductor device
#157Semiconductor device and method for producing the same, and power supply
#158Rule-based semiconductor die stacking and bonding within a multi-die package
#159Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices
#160Light-emitting device package and method of manufacturing the same
#161Multi chip package
#162Semiconductor device and production method therefor
#163Vertically integrated systems
#164Enhanced stacked microelectronic assemblies with central contacts
#165Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#166Elimination of RDL using tape base flip chip on flex for die stacking
#167SEMICONDUCTOR DEVICE
#168Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#169Electronic device and method of manufacturing electronic device
#170Brace for long wire bond
#171Electronic devices
#172Multi-chip stacking method to reduce voids between stacked chips
#173Semiconductor packages and methods for producing the same
#174Wire bonding apparatus and method using the same
#175Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#176ANTENNA
#177Semiconductor module
#178Reversible top/bottom MEMS package
#179Semiconductor device having die pads isolated from interconnect portion and method of assembling same
#180METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
#181Methods and apparatus for a stacked-die interposer
#182Light emitting diode package having improved wire bonding structure
#183Semiconductor device
#184Submount and manufacturing method thereof
#185Semiconductor device comprising thin-film terminal with deformed portion
#186SEMICONDUCTOR DEVICE
#187Brace for wire bond
#188Circuit device having an improved heat dissipitation, and the method of manufacturing the same
#189METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS
#190Integrated circuit with intra-chip clock interface and methods for use therewith
#191Ball grid array semiconductor package and method of manufacturing the same
#192Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#193Multi-chip package with offset die stacking
#194SEMICONDUCTOR PACKAGE
#195Semiconductor device and method for manufacturing thereof
#196Semiconductor memory device and semiconductor memory card
#197Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
#198Stitch bump stacking design for overall package size reduction for multiple stack
#199VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
#200Impedance controlled electrical interconnection employing meta-materials
#201Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board
#202Systems and Methods for Heat Dissipation Using Thermal Conduits
#203Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds
#204Methods of operating electronic devices, and methods of providing electronic devices
#205ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
#206Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#207LED-BASED LIGHT EMITTING DEVICES
#208Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#209Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
#210Stackable molded microelectronic packages
#211Semiconductor device assembly and method thereof
#212SEMICONDUCTOR DEVICE
#213Multi-chip package module and a doped polysilicon trench for isolation and connection
#214Conductive bumps, wire loops, and methods of forming the same
#215Thermally and electrically enhanced ball grid array package
#216Semiconductor device with lead terminals having portions thereof extending obliquely
#217Cut-edge positioning type soldering structure and method for preventing pin deviation
#218Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
#219Multi-chip stack package structure
#220Multi-chip stack package structure
#221Multi-chip stack package structure
#222Etched surface mount islands in a leadframe package
#223Combined packaged power semiconductor device
#224Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
#225PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS
#226Semiconductor integrated circuit device and method of manufacturing the same
#227STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD
#228Method for the miniaturizable contacting of insulated wires
#229Surface mountable device
#230AC switch having compound semiconductor MOSFETs
#231Liquid discharge head and manufacturing method therefor
#232Method for fabricating chip elements provided with wire insertion grooves
#233Microelectronic assembly with joined bond elements having lowered inductance
#234Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
#235Circuitry and Method for Encapsulating the Same
#236Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#237Semiconductor device and a manufacturing method of the same
#238Semiconductor chip with post-passivation scheme formed over passivation layer
#239Power switch component having improved temperature distribution
#240APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING
#241Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#242Wire bonding structure of semiconductor device and wire bonding method
#243SEMICONDUCTOR DEVICE
#244Semiconductor device packages including connecting elements
#245Semiconductor device package having a jumper chip and method of fabricating the same
#246Method of sensing magnitude of current through semiconductor power device
#247Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#248METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS
#249Thin package system with external terminals and method of manufacture thereof
#250Semiconductor device assemblies
#251METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#252Led lead frame structure
#253Semiconductor device and electronic device
#254Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#255Rule-based semiconductor die stacking and bonding within a multi-die package
#256SEMICONDUCTOR PACKAGE
#257Interconnection tape providing a serial electrode pad connection in a semiconductor device
#258LED package
#259Semiconductor package structure
#260LED assembly with a protective frame
#261Method of manufacturing a semiconductor device
#262Interconnection structure and its design method
#263Multi-chip package having frame interposer
#264Semiconductor integrated circuit
#265Semiconductor device and manufacturing method thereof
#266Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#267Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
#268Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#269Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
#270SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#271Method of manufacturing semiconductor device
#272Inductive relayed coupling circuit between substrates
#273Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
#274Contacting a device with a conductor
#275Circuit board and its wire bonding structure
#276Method of manufacturing semiconductor device
#277Integrated circuit with inductive bond wires
#278Radio frequency amplifier with effective decoupling
#279Microelectronic assembly with joined bond elements having lowered inductance
#280MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE
#281Semiconductor connection component
#282Integrated circuit packaging system with bond wire pads and method of manufacture thereof
#283Semiconductor device having a microcomputer chip mounted over a memory chip
#284Method of forming at least one bonding structure
#285Semiconductor device and method of manufacturing the same
#286Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method
#2873D interconnection structure and method of manufacturing the same
#288INTEGRATED PASSIVE DEVICE ASSEMBLY
#289Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals
#290Electrical bond connection system
#291THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM
#292SEMICONDUCTOR DEVICE
#293Semiconductor device and method of manufacturing the same
#294Bonding apparatus and bonding method
#295Semiconductor memory device and semiconductor memory card using the same
#296POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS
#297Microelectronic assembly with impedance controlled wirebond and conductive reference element
#298Microelectronic assembly with impedance controlled wirebond and conductive reference element
#299Adhesive on wire stacked semiconductor package
#300Packaged semiconductor assemblies and methods for manufacturing such assemblies