211670 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding techniques; Soldering or alloying involving forming an intermetallic compound at the bonding interface
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#2SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
#3LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR PACKAGES
#4SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
#5Semiconductor packages with an intermetallic layer
#6Semiconductor packages with an intermetallic layer
#7Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
#8Semiconductor manufacturing for forming bond pads and seal rings
#9Electronic component package and method for forming same
#10Wafer and semiconductor package