H01L2224/858 - CPC Classification Index

ClassID:

211667 ⎘

H01L2224/858 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector Bonding techniques

Sub-classes:

H01L2224/85801 » Soldering or alloying 81
H01L2224/8584 » Sintering 28
H01L2224/8585 » using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester 21
H01L2224/8589 » using an inorganic non metallic glass type adhesive, e.g. solder glass 0
H01L2224/85893 » Anodic bonding, i.e. bonding by applying a voltage across the interface in order to induce ions migration leading to an irreversible chemical bond 0
H01L2224/85895 » Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces 4
H01L2224/85899 » Combinations of bonding methods provided for in at least two different groups from to 1

Recent Application in this class:

20250266392

Semiconductor packaging method and semiconductor packaging structure

20240429144

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE WITH ENCAPSULATED PINS

20240429137

DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR

20240258210

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOPSIDE AND SIDEWALL

20240194629

Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach

20240079375

BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

20220367329

CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

20180108629

Semiconductor device and method of manufacturing the same

20170040272

Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same

20160240499

Semiconductor Device and Method of Manufacturing the Same

20150044821

Method for fabricating multi-chip stack structure

20140248747

Chip-on-lead package and method of forming

20130292856

Method for the wafer-level integration of shape memory alloy wires

20130234313

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

20130168866

Chip-on-lead package and method of forming

20130092742

Inclusion of chip elements in a sheathed wire

20130033879

Method for assembling at least one chip using a fabric, and fabric including a chip device

20110198735

Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

20090140440

Multi-chip stack structure and method for fabricating the same

20060097911

Wire positioning and mechanical attachment for a radio-frequency indentification device