ClassID:

211672

H01L2224/8582 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding techniques; Soldering or alloying Diffusion bonding

Sub-classes:
Recent Application in this class: