H01L2224/8585 - CPC Classification Index

ClassID:

211676 ⎘

H01L2224/8585 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester

Sub-classes:

H01L2224/85855 » Hardening the adhesive by curing, i.e. thermosetting 2
H01L2224/8588 » Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives 2
H01L2224/85885 » Combinations of two or more hardening methods provided for in at least two different groups from to , e.g. for hybrid thermoplastic-thermosetting adhesives 0

Recent Application in this class:

20190027267

2019-01-24

Anisotropic conductive film

20180240772

2018-08-23

Electronic device by laser-induced forming and transfer of shaped metallic interconnects

20170221851

2017-08-03

Laser-induced forming and transfer of shaped metallic interconnects

20170103902

2017-04-13

Laser-induced forming and transfer of shaped metallic interconnects

20160148859

2016-05-26

Semiconductor device and manufacturing method thereof

20150060878

2015-03-05

Semiconductor packages having multiple lead frames and methods of formation thereof

20140008702

2014-01-09

Semiconductor packages having multiple lead frames and methods of formation thereof

20130234313

2013-09-12

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

20120322207

2012-12-20

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

#10

20120228768

2012-09-13

INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHOD OF MANUFACTURE THEREOF

#11

20110310577

2011-12-22

Electrical microfilament to circuit interface

#12

20110217877

2011-09-08

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS

#13

20110070698

2011-03-24

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

#14

20110068457

2011-03-24

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

#15

20100264534

2010-10-21

Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure

#16