H01L2224/85895 - CPC Classification Index

ClassID:

211690 ⎘

H01L2224/85895 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector; Bonding techniques Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces

Sub-classes:

H01L2224/85897 » between electrically conductive surfaces, e.g. copper-copper direct bonding, surface activated bonding 5
H01L2224/85898 » between electrically insulating surfaces, e.g. oxide or nitride layers 3

Recent Application in this class:

20100123243

2010-05-20

FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE

20070052075

2007-03-08

Semiconductor device and method of manufacturing the same

20070015352

2007-01-18

Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads

20050212101

2005-09-29

Semiconductor device and method of manufacturing the same