ClassID:

211720

H01L2224/86005 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate

Recent Application in this class: