H01L2224/86 - CPC Classification Index

ClassID:

211717 ⎘

H01L2224/86 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Sub-classes:

H01L2224/86001 » involving a temporary auxiliary member not forming part of the bonding apparatus 0
H01L2224/86007 » involving a permanent auxiliary member being left in the finished device e.g. aids for holding or protecting the TAB connector during or after the bonding process 2
H01L2224/86009 » Pre-treatment of the connector or the bonding area 0
H01L2224/86053 » Bonding environment 0
H01L2224/861 » the connector being supplied to the parts to be connected in the bonding apparatus 0
H01L2224/8611 » involving protection against electrical discharge, e.g. removing electrostatic charge 1
H01L2224/8612 » Aligning 1
H01L2224/862 » Applying energy for connecting 0
H01L2224/8634 » Bonding interfaces of the connector 0
H01L2224/8636 » Bonding interfaces of the semiconductor or solid state body 0
H01L2224/8638 » Bonding interfaces outside the semiconductor or solid-state body 0
H01L2224/868 » Bonding techniques 0
H01L2224/869 » involving monitoring, e.g. feedback loop 0
H01L2224/86909 » Post-treatment of the connector or the bonding area 0
H01L2224/86986 » Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence 0

Recent Application in this class:

20250258410

2025-08-14

DISPLAY DEVICE

20240284594

2024-08-22

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF

20240111194

2024-04-04

Display device

20230309225

2023-09-28

Electronic component, electric device including the same, and bonding method thereof

20230009817

2023-01-12

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF

20220276523

2022-09-01

Display device

20210003876

2021-01-07

Display device

20190281699

2019-09-12

Electronic component, electric device including the same, and bonding method thereof

20190278125

2019-09-12

Display device

#10

20180263116

2018-09-13

Electronic component, electric device including the same, and bonding method thereof

#11

20180149901

2018-05-31

Display device

#12

20150103500

2015-04-16

Electronic component, electric device including the same, and bonding method thereof

#13

20140321088

2014-10-30

Display panel, electronic device including the same, and bonding method thereof

#14

20120264257

2012-10-18

MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

#15

20090291554

2009-11-26

Semiconductor chip and method for fabricating the same

#16

20090166826

2009-07-02

LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES

#17

20090014874

2009-01-15

Semiconductor package with reduced length interconnect and manufacturing method thereof

#18

20080248612

2008-10-09

Asymmetric alignment of substrate interconnect to semiconductor die

#19

20080111230

2008-05-15

WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

#20

20080067635

2008-03-20

Chip-mounted film package

#21

20080054457

2008-03-06

Semiconductor chip and method for fabricating the same

#22

20080017973

2008-01-24

Semiconductor device and manufacturing method therefor

#23

20070272994

2007-11-29

SENSOR SEMICONDUCTOR DEVICE

#24

20070181060

2007-08-09

Direct write# system

#25

20070161157

2007-07-12

Semiconductor device package and method for manufacturing same

#26

20070102803

2007-05-10

Method for making stacked integrated circuits (ICs) using prepackaged parts

#27

20070096303

2007-05-03

Asymmetric alignment of substrate interconnect to semiconductor die

#28

20070096292

2007-05-03

Electronic-part built-in substrate and manufacturing method therefor

#29

20070052070

2007-03-08

Die pad for semiconductor packages and methods of making and using same

#30

20070045867

2007-03-01

Board having electronic parts mounted by using under-fill material and method for producing the same

#31

20070044303

2007-03-01

Method of manufacturing wiring board

#32

20060270089

2006-11-30

Method for fabricating sensor semiconductor device

#33

20060267135

2006-11-30

Circuit arrangement placed on a substrate and method for producing the same

#34

20060244130

2006-11-02

Multi-chip semiconductor package

#35

20060186533

2006-08-24

Chip scale package with heat spreader

#36

20060180906

2006-08-17

Chip package and producing method thereof

#37

20060141665

2006-06-29

Substrate having a plurality of I/O routing arrangements for a microelectronic device

#38

20060121719

2006-06-08

Method of manufacturing a circuit substrate and method of manufacturing an electronic parts packaging structure

#39

20060091487

2006-05-04

Manufacturing method of solid-state image sensing device

#40

20060065984

2006-03-30

Package stress management

#41

20060001158

2006-01-05

Package stress management

#42

20050253247

2005-11-17

Semiconductor device and manufacturing method therefor

#43

20050248038

2005-11-10

Chip scale package with heat spreader

#44

20050224954

2005-10-13

Thermal dissipation in integrated circuit systems

#45

20050163917

2005-07-28

Direct writeTM system

#46

20050139963

2005-06-30

Chip-mounted film package

#47

20050046664

2005-03-03

Direct write™ system