H01L2224/86205 - CPC Classification Index

ClassID:

211762 ⎘

H01L2224/86205 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Applying energy for connecting; Compression bonding Ultrasonic bonding

Sub-classes:

H01L2224/86207 » Thermosonic bonding 0

Recent Application in this class:

20110097848

2011-04-28

Method for connecting a die assembly to a substrate in an integrated circuit

20070040251

2007-02-22

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly