H01L2224/8621 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Applying energy for connecting with energy being in the form of electromagnetic radiation

• H01L2224/86212 » Induction heating, i.e. eddy currents 0
• H01L2224/86214 » using a laser 3
• H01L2224/8623 » Polychromatic or infrared lamp heating 0
• H01L2224/86232 » using an autocatalytic reaction, e.g. exothermic brazing 0
• H01L2224/86234 » using means for applying energy being within the device, e.g. integrated heater 0
• H01L2224/86236 » using electro-static corona discharge 0
• H01L2224/86237 » using electron beam 0
• H01L2224/86238 » using electric resistance welding, i.e. ohmic heating 0