ClassID:

211779

H01L2224/86375 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]; Bonding interfaces of the semiconductor or solid state body having an external coating, e.g. protective bond-through coating