H01L2224/8638 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] Bonding interfaces outside the semiconductor or solid-state body

• H01L2224/86385 » Shape, e.g. interlocking features 0
• H01L2224/86395 » having an external coating, e.g. protective bond-through coating 0
• H01L2224/86399 » Material 3