H01L2224/86909 - CPC Classification Index

ClassID:

211813 ⎘

H01L2224/86909 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB] Post-treatment of the connector or the bonding area

Sub-classes:

H01L2224/8691 » Cleaning, e.g. oxide removal step, desmearing 0
H01L2224/8693 » Reshaping 0
H01L2224/86948 » Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling 0
H01L2224/86951 » Forming additional members 0