211852 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a strap connector the second connecting process involving a wire connector
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2DUAL SWITCHING POWER DEVICE
#3CLIP STRUCTURE FOR A PACKAGED SEMICONDUCTOR DEVICE
#4HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL
#5SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#6Semiconductor device assembly and method therefor
#7Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
#8Semiconductor device assembly and method therefor
#9Semiconductor devices and methods of making the same
#10Semiconductor device
#11Semiconductor devices and methods of making the same
#12Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#13Semiconductor module package and method of manufacturing the same
#14Lead Frame Packages and Methods of Formation Thereof
#15Semiconductor device
#16SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#17Semiconductor device including a contact clip having protrusions and manufacturing thereof
#18Power package module with low and high power chips and method for fabricating the same
#19Semiconductor device attached to island having protrusion