ClassID:

211861

H01L2224/92173 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups  - ; Specific sequence of method steps; Connecting a surface with connectors of different types; Sequential connecting processes the first connecting process involving a TAB connector the second connecting process involving a bump connector