211869 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting different surfaces of the semiconductor or solid-state body with connectors of different types; Sequential connecting processes the first connecting process involving a bump connector
Sub-classes:DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-ON-INSULATOR SUBSTRATE
#2Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
#3SEMICONDUCTOR PACKAGE
#4Methods related to radio-frequency filters on silicon-on-insulator substrate
#5Semiconductor structure and manufacturing method thereof
#6Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
#7Semiconductor structure and manufacturing method thereof
#8Die encapsulation in oxide bonded wafer stack
#9Die encapsulation in oxide bonded wafer stack
#10Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
#11Semiconductor package structure with polymeric layer and manufacturing method thereof
#12Test probe head for full wafer testing
#13Making an integrated circuit module with dual leadframes
#14Methods of processing substrates
#15Wafer carrier having cavity
#16Wafer-level device packaging
#17Method of forming stacked dies
#18Device having a bonding structure for two elements
#19Plurality of devices attached by solder bumps
#20Methods of bonding two semiconductor devices
#21Methods of bonding two semiconductor devices