211880 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups - ; Specific sequence of method steps; Connecting different surfaces of the semiconductor or solid-state body with connectors of different types; Sequential connecting processes the first connecting process involving a strap connector
Sub-classes:Method for fabricating stack die package
#2Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#3Method for fabricating stack die package
#4METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK