211937 ⎘
Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups - the devices not having separate containers the devices being of a type provided for in group; Stacked arrangements of devices Auxiliary carrier between devices, the carrier having no electrical connection structure
SEMICONDUCTOR DEVICE INCLUDING A THERMAL RELIEF LAYER
#2TABLET ULTRASOUND SYSTEM
#3INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#4SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
#5THERMALLY CONDUCTIVE SPACER
#6PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE
#7SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
#8TERRACED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
#9SEMICONDUCTOR PACKAGE
#10PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#11Tablet ultrasound system
#12SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
#13Semiconductor package
#14Stack packages including supporter
#15SEMICONDUCTOR DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#16Semiconductor package
#17Integrated circuit package having wirebonded multi-die stack
#18Semiconductor device and method of manufacturing semiconductor device
#19Semiconductor memory device
#20Semiconductor device
#21Integrated circuit package with glass spacer
#22Semiconductor device and method for manufacturing the same
#23Stacked semiconductor package and packaging method thereof
#24Method for manufacturing semiconductor device having dolmen structure, method for manufacturing support piece, and laminated film
#25Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor
#26Tablet ultrasound system
#27Stack packages including supporter
#28Semiconductor package
#29Packaged semiconductor devices having spacer chips with protective groove patterns therein
#30Semiconductor device and method of manufacturing semiconductor device
#31Semiconductor package
#32Integrated circuit package with glass spacer
#33Semiconductor device and method for manufacturing the same
#34Semiconductor package and method of manufacturing semiconductor package
#35Semiconductor device and semiconductor device manufacturing method
#36Semiconductor device
#37Semiconductor device with a protection mechanism and associated systems, devices, and methods
#38Semiconductor memory device
#39Semiconductor device assembly with die support structures
#40Semiconductor packages with chips partially embedded in adhesive
#41Dynamically configurable multi-chip package
#42Stair-stacked dice device in a system in package, and methods of making same
#43Semiconductor device
#44Multi-chip modules including stacked semiconductor dice
#45Semiconductor device package
#46Semiconductor device with a protection mechanism and associated systems, devices, and methods
#47Semiconductor device
#48ELECTRONIC SYSTEM PROVIDED WITH A PLURALITY OF INTERCONNECTED ELECTRONIC FUNCTIONS
#49Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#50Method for packaging circuits
#51Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof
#52Electronic assembly and electronic system with impedance matched interconnect structures
#53Semiconductor device
#54Packaged semiconductor components having substantially rigid support members
#55Integrated circuit with backside structures to reduce substrate warp
#56Packaged semiconductor devices and methods of packaging thereof
#57SYSTEM IN PACKAGE (SIP) WITH DUAL LAMINATE INTERPOSERS
#58Methods to form reduced form factor radio frequency system-in-package
#59Semiconductor packages including a multi-chip stack
#60Stair-stacked dice device in a system in package, and methods of making same
#61Semiconductor device
#62Package-in-package structure for semiconductor devices and methods of manufacture
#63Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#64Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging
#65Semiconductor package with supported stacked die
#66On-bonder automatic overhang die optimization tool for wire bonding and related methods
#67Semiconductor package having spacer layer
#68Semiconductor device including control switches to reduce pin capacitance
#69Semiconductor device assembly with die support structures
#70INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
#71Semiconductor device and manufacturing method thereof
#72Semiconductor packages having asymmetric chip stack structure
#73Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#74Integrated circuit package having wirebonded multi-die stack
#75Thermal management of molded packages
#76Tablet ultrasound system
#77Semiconductor device
#78Integrated circuit package assembly with wire end above a topmost component
#79Non-volatile memory with stacked semiconductor chips
#80FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#81Magnetic memory device
#82Semiconductor device including interconnected package on package
#83Package-on-package type semiconductor device including fan-out memory package
#84Semiconductor device package
#85Semiconductor package
#86METHOD FOR EMBEDDING SILICON DIE INTO A STACKED PACKAGE
#87Reduced form factor radio frequency system-in-package
#88System in package with vertically arranged radio frequency componentry
#89Integrated circuit with backside structures to reduce substrate warp
#90Laminated semiconductor device and manufacturing method of laminated semiconductor device
#91Non-volatile memory and devices that use the same
#92Method for packaging circuits
#93Package on-package method
#94STACK PACKAGE AND METHOD FOR MANUFACTURING THE STACK PACKAGE
#95Semiconductor package having spacer layer
#96Stress isolation features for stacked dies
#97Arrangement of multiple power semiconductor chips and method of manufacturing the same
#98Circuit packages including modules that include at least one integrated circuit
#99Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology
#100Stacking arrangement for integration of multiple integrated circuits
#101SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#102Integrated circuit package having wirebonded multi-die stack
#103SEMICONDUCTOR MODULE
#104Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#105TABLET ULTRASOUND SYSTEM
#106Isolator with reduced susceptibility to parasitic coupling
#107Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis
#108Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof
#109Semiconductor stack packages
#110Packaged semiconductor devices and methods of packaging thereof
#111Stack of integrated-circuit chips and electronic device
#112Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#113Semiconductor package devices
#114Stacked semiconductor die assemblies with support members and associated systems and methods
#115Methods and apparatus for package with interposers
#116Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#117Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#118Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#119Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#120Submount, encapsulated semiconductor element, and methods of manufacturing the same
#121Electronic system comprising stacked electronic devices comprising integrated-circuit chips
#122Semiconductor device assemblies including face-to-face semiconductor dice and related methods
#123Method for fabricating multi-chip stack structure
#124Heat-transfer structure
#125Semiconductor package and fabrication method thereof
#126Methods and materials useful for chip stacking, chip and wafer bonding
#127Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#128Impedance controlled packages with metal sheet or 2-layer rdl
#129Apparatus and method to attach a wireless communication device into a semiconductor package
#130Semiconductor device with wiring substrate including conductive pads and testing conductive pads
#131System in package (SIP) with dual laminate interposers
#132Semiconductor device manufacturing method
#133Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate
#134Methods and apparatus for package with interposers
#135Method for packaging circuits
#136Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#137Interposer and semiconductor module using the same
#138Adhesive film, method of manufacturing semiconductor device, and semiconductor device
#139Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#140Multi Chip Package-type semiconductor device
#141Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#142INTEGRATED CIRCUIT PACKAGE
#143Semiconductor package with package on package structure
#144Semiconductor package including flip chip controller at bottom of die stack
#145Interposer for stacked semiconductor devices
#146Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice
#147DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME
#148Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#149Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#150Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#151Method of manufacturing a three-dimensional packaging semiconductor device
#152Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
#153Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure
#154Stackable integrated circuit package system
#155Semiconductor device
#156Semiconductor device
#157PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#158Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
#159Stacked electronic component and manufacturing method thereof
#160Methods for forming assemblies and multi-chip modules including stacked semiconductor dice
#161Chip stacking
#162Integrated void fill for through silicon via
#163Enhanced modularity in heterogeneous 3D stacks
#164Enhanced modularity in heterogeneous 3D stacks
#165Enhanced Modularity in Heterogeneous 3D Stacks
#166Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#167Semiconductor device
#168Integrated circuit package system with waferscale spacer
#169DIE-BONDING FILM AND USE THEREOF
#170INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF
#171Semiconductor package having substrate for high speed semiconductor package
#172Semiconductor device with stacked semiconductor chips
#173SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#174Semiconductor device, method of manufacturing semiconductor device, and electronic device
#175SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#176Methods and materials useful for chip stacking, chip and wafer bonding
#177Semiconductor device
#178Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#179Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#180THERMOSETTING DIE-BONDING FILM
#181Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#182Void-free wafer bonding using channels
#183Semiconductor device with wiring substrate including lower conductive pads and testing conductive pads
#184MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
#185Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#186Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
#187Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#188Airgap micro-spring interconnect with bonded underfill seal
#189Set of resin compositions for preparing system-in-package type semiconductor device
#190Metal can impedance control structure
#191Impedance controlled packages with metal sheet or 2-layer RDL
#192Method for packaging circuits
#193Stacked semiconductor chips with thermal management
#194Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles
#195Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#196Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
#197Method and system for thin multi chip stack package with film on wire and copper wire
#198Methods of making a semiconductor device
#199Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#200Semiconductor device
#201Shielded stacked integrated circuit packaging system and method of manufacture thereof
#202ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#203Enhanced modularity in heterogeneous 3D stacks
#204Stacked electronic component and manufacturing method thereof
#205Semiconductor device assemblies
#206Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#207Method of stacking flip-chip on wire-bonded chip
#208Integrated void fill for through silicon via
#209Method for manufacturing electronic device and electronic device
#210Multiple integrated circuit die package with thermal performance
#211Lead frame land grid array with routing connector trace under unit
#212Integrated circuit packaging system with package stacking and method of manufacture thereof
#213Integrated circuit packaging system with interconnect and method of manufacture thereof
#214Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same
#215Microelectronic devices and methods for manufacturing microelectronic devices
#216Semiconductor package including flip chip controller at bottom of die stack
#217Method and structure for bonding flip chip
#218MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#219Adhesive on wire stacked semiconductor package
#220Integrated circuit package system for stackable devices and method for manufacturing thereof
#221Method and apparatus for manufacturing stacked-type semiconductor device
#222Interposer, semiconductor chip mounted sub-board, and semiconductor package
#223Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#224INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
#225Stacked-die package including substrate-ground coupling
#226ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME
#227Wafer Level Stacked Die Packaging
#228BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
#229Semiconductor device
#230Method of manufacturing a semiconductor device and a testing method of the same
#231High-bandwidth ramp-stack chip package
#232Semiconductor packages including heat slugs
#233Encapsulant cavity integrated circuit package system and method of fabrication thereof
#234Method for aligning and bonding elements and a device comprising aligned and bonded elements
#235Process for producing a semiconductor device
#236SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#237Integrated circuit packaging system with a stack package and method of manufacture thereof
#238Method of manufacturing an electronic device
#239METHOD OF MANUFACTURING DICING DIE-BONDING FILM
#240Airgap micro-spring interconnect with bonded underfill seal
#241Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same
#242Multi-chip stacked package
#243Integrated circuit package system with offset stacking and anti-flash structure
#244Semiconductor device, method of manufacturing the same, and silane coupling agent
#245Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
#246Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
#247PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS
#248Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#249Thee-dimensional integrated semiconductor device and method for manufacturing same
#250Integrated circuit packaging system with stacked die and method of manufacture thereof
#251Method for embedding silicon die into a stacked package
#252PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#253Stack package
#254SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#255Semiconductor device with stacked semiconductor chips
#256Manufacturing method of semiconductor device
#257Integrated circuit package system including shield
#258Thermal spacer for stacked die package thermal management
#259Semiconductor device
#260METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#261Method and apparatus for multi-chip packaging
#262Side stacking apparatus and method
#263Semiconductor device
#264Method for packaging circuits
#265SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL
#266Package-on-package device, semiconductor package and method for manufacturing the same
#267Flash memory card
#268Semiconductor device
#269Semiconductor device
#270PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#271Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate
#272Thermosetting die-bonding film
#273Integrated circuit package system for stackable devices
#274Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
#275Multi-chip module and methods
#276ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME
#277Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
#278Method of manufacturing stacked semiconductor device
#279Microelectronic packages with small footprints and associated methods of manufacturing
#280STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME
#281Method of fabricating stacked wire bonded semiconductor package with low profile bond line
#282Method of fabricating stacked semiconductor package with localized cavities for wire bonding
#283Chip arrangement and method of manufacturing a chip arrangement
#284Stacked wire bonded semiconductor package with low profile bond line
#285Stacked semiconductor package with localized cavities for wire bonding
#286Magnetic field sensor arrangement and method for non-contact measurement of a magnetic field
#287Heat-transfer structure
#288Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device
#289Stacked structure of integrated circuits having space elements
#290Package-on-package system with heat spreader
#291Electronic device and method of manufacturing an electronic device
#292SEMICONDUCTOR CHIP HAVING GETTERING LAYER, AND METHOD FOR MANUFACTURING THE SAME
#293Package structure and method
#294Multi-chip package including component supporting die overhang and system including same
#295Semiconductor device and manufacturing method thereof
#296SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY
#297METHOD OF STACKING DIES FOR DIE STACK PACKAGE
#298Integrated circuit package system with support structure for die overhang
#299Semiconductor device packages and assemblies
#300Chip structure and stacked chip package as well as method for manufacturing chip structures