211938 ⎘
Details relating to assemblies covered by the group but not provided for in its subgroups; All the devices being of a type provided for in the same subgroup of groups - the devices not having separate containers the devices being of a type provided for in group; Stacked arrangements of devices TAB carriers; beam leads
DISPLAY DEVICE
#2ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#3Display device
#4Electronic component, electric device including the same, and bonding method thereof
#5ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#6Display device
#7Display device
#8Die stack structure and method of fabricating the same
#9Electronic device
#10Mounting structures for integrated device packages
#11Electronic component, electric device including the same, and bonding method thereof
#12Display device
#13Semiconductor structure
#14Electronic component, electric device including the same, and bonding method thereof
#15Semiconductor module
#16Semiconductor structure and manufacturing method thereof
#17Heterogeneous integration of ultrathin functional block by solid phase adhesive and selective transfer
#18Display device
#19Package-on-package structure and manufacturing method thereof
#20Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bonding
#21Heat transfer device for high heat flux applications and related methods thereof
#22Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bonding
#23Low profile integrated circuit (IC) package comprising a plurality of dies
#24Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin Composition
#25Chip stack structure using conductive film bridge adhesive technology
#26Processes and structures for IC fabrication
#27Electronic component, electric device including the same, and bonding method thereof
#28Semiconductor device assemblies including face-to-face semiconductor dice and related methods
#29Display panel, electronic device including the same, and bonding method thereof
#30Ramp-stack chip package with variable chip spacing
#31Processes and structures for IC fabrication
#32Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice
#33Semiconductor device including semiconductor chips with different thickness
#34Packaging an electronic device
#35THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCORPORATION BY REFERENCE
#36Elimination of RDL using tape base flip chip on flex for die stacking
#37Method for manufacturing a microelectronic device and a microelectronic device thus manufactured
#38Substrate arrangement
#39Integrated circuit package system employing device stacking
#40Method for connecting a die assembly to a substrate in an integrated circuit
#41HIGH-DENSITY MEMORY ASSEMBLY
#42Encapsulant interposer system with integrated passive devices and manufacturing method therefor
#43SEMICONDUCTOR DEVICE MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MODULE
#44Integrated circuit package system employing device stacking and method of manufacture thereof
#45Methods to fabricate integrated circuits by assembling components
#46Processes and structures for IC fabrication
#47Methods for interconnecting bonding pads between components
#48Processes and structures for IC fabrication
#49Processes for IC fabrication
#50Staircase shaped stacked semiconductor package
#51Stacked multichip package
#52Semiconductor package with ribbon with metal layers
#53Multi-die building block for stacked-die package
#54High-density multifunctional PoP-type multi-chip package structure
#55Stacked semiconductor device and method of manufacturing the same
#56Flash memory card
#57Very extremely thin semiconductor package
#58Encapsulant interposer system with integrated passive devices and manufacturing method therefor
#59Semiconductor chip with through-silicon-via and sidewall pad
#60High density three dimensional semiconductor die package
#61Stacked die semiconductor device having circuit tape
#62Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
#63Semiconductor package
#64Semiconductor module and an electronic system including the same
#65STACK TYPE SEMICONDUCTOR DEVICE WITH REINFORCING RESIN
#66SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#67Integrated circuit package stacking system
#68LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
#69Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#70Device interconnects
#71Method for forming lead frame land grid array
#72Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate
#73Integrated circuit device and a method of making the integrated circuit device
#74Semiconductor device including semiconductor chips with different thickness
#75SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD
#76Laminated mounting structure and memory card
#77Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor
#78APPARATUS FOR PACKAGING A TAPE SUBSTRATE
#79Low profile stacking system and method
#80Semiconductor device
#81Component and assemblies with ends offset downwardly
#82Integrated circuit package system with flexible substrate and mounded package
#83Integrated circuit package system employing device stacking
#84Flash memory card
#85Low profile chip scale stacking system and method
#86Bare chip mounted structure and mounting method
#87Stacked semiconductor chips having double adhesive insulating layer interposed therebetween
#88Integrated circuit device mounting with folded substrate and interposer
#89Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
#90Stacked Modules and Method
#91MULTI-CHIP STRUCTURE
#92WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#93Stacked Modules and Method
#94Stacked Modules and Method
#95Stacked modules and method
#96Elimination of RDL using tape base flip chip on flex for die stacking
#97Stacked die semiconductor device having circuit tape
#98Semiconductor package having flexible lead connection plate for electrically connecting base and chip
#99Die assembly having electrical interconnect
#100Electronic unit and electronic apparatus having the same
#101Semiconductor Module with Serial Bus Connection to Multiple Dies
#102Semiconductor Module with Serial Bus Connection to Multiple Dies
#103Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#104Folding chip planar stack package
#105Arrangement of semiconductor memory devices and semiconductor memory module comprising an arrangement of semiconductor memory devices
#106Semiconductor Module with Serial Bus Connection to Multiple Dies
#107Semiconductor Module With Serial Bus Connection to Multiple Dies
#108Chip package and method for fabricating the same
#109Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies
#110Packaging method of a plurality of chips stacked on each other and package structure thereof
#111Embedded heat spreader
#112Low Profile Stacking System and Method
#113Low Profile Stacking System and Method
#114Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
#115High density three dimensional semiconductor die package
#116High frequency chip packages with connecting elements
#117Semiconductor package
#118Flash memory card
#119Flash memory card
#120Flexible assembly of stacked chips
#121Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
#122Semiconducting device with folded interposer
#123Semiconducting device with folded interposer
#124Stacked semiconductor package
#125Chip stack package having same length bonding leads
#126Microelectronic loop packages
#127Three-dimensional multichip stack electronic package structure
#128Stacking system and method
#129Stacked modules and method
#130Method of forming a stack of packaged memory dice
#131Stacked type semiconductor device
#132Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
#133Microelectronic component and assembly having leads with offset portions
#134Semiconductor device, manufacturing method thereof, and connection method of circuit board
#135Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
#136Forming folded-stack packaged device using progressive folding tool
#137Forming folded-stack packaged device using progressive folding tool
#138Method of forming folded-stack packaged device using progressive folding tool
#139Forming folded-stack packaged device using progressive folding tool
#140Folded interposer
#141Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density
#142Multi-chip package and method for manufacturing the same
#143Semiconductor device and method of manufacturing thereof
#144Semiconductor package using flexible film and method of manufacturing the same
#145Embedded heat spreader
#146Adhesive of folder package
#147Stacking system and method
#148Memory module having interconnected and stacked integrated circuits
#149CSP chip stack with flex circuit
#150Microelectronic assemblies incorporating inductors
#151Stacked module systems
#152Stacking system and method
#153Power distribution within a folded flex package method and apparatus
#154Method of forming folded-stack packaged device using vertical progression folding tool
#155Folded substrate with interposer package for integrated circuit devices
#156Stacked die module and techniques for forming a stacked die module
#157Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same
#158Electronic package having a folded flexible substrate and method of manufacturing the same
#159Integrated circuit stacking system and method
#160Stacking system and method
#161High density multilayer circuit module
#162Manufacturing methods for semiconductor structures having stacked semiconductor devices
#163Flex-based circuit module
#164Micropede stacked die component assembly
#165High-frequency chip packages
#166Flexible multi-chip module and method of making the same
#167Adhesive of folded package
#168Three-dimensional multichip stack electronic package structure
#169Microelectronic assembly having encapsulated wire bonding leads
#170Tape automated bonding with strip carrier frame assembly
#171Semiconducting device with folded interposer
#172Method of forming a stack of packaged memory dice
#173Microelectronic adaptors, assemblies and methods
#174Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#175Low profile stacking system and method
#176Pitch change and chip scale stacking system and method
#177System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
#178Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
#179Microelectronic component and assembly having leads with offset portions
#180Memory expansion and chip scale stacking system and method
#181Memory expansion and chip scale stacking system and method
#182Electronic package having a folded flexible substrate and method of manufacturing the same
#183High-frequency chip packages
#184Integrated circuit stacking system and method
#185Integrated circuit stacking system
#186Integrated circuit stacking system
#187Volumetrically efficient electronic circuit module
#188Semiconductor package using flexible film and method of manufacturing the same
#189Process for manufacturing semiconductor device
#190Pitch change and chip scale stacking system
#191Stacked module systems and methods for CSP packages